Knowledge Flow in East Asia and Beyond
East Asia is emerging as a hub of technological innovation. This paper investigates the extent to which East Asia has become a source of international knowledge diffusion and whether such diffusion is localized to the region. Using citations made by U.S. Patent and Trademark Office (USPTO) granted patents to other USPTO patents as an indicator of knowledge flow and estimating a model of international knowledge diffusion, I find strong evidence corroborating the hypothesis of increasing regionalization of knowledge flow in East Asia. Korea and Taiwan, the region's leading innovators, cite each other at least as frequently as they cite the US and Japan. Such knowledge flow has substantially intensified since the mid 1990s. With the exception of Thailand, all of the East Asian economies that I examine, Hong Kong, Singapore, China, and Malaysia, cite Korea and Taiwan at least as frequently as they cite the US and Japan. The "G5" group, which includes Britain, Canada, France, Germany and Italy, has been the least often cited source of knowledge for East Asia.
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- Jaffe, A.B. & Trajtenberg, M., 1992.
"Geographic Localization of Knowledge Spillovers as Evidenced by Patent Citations,"
14-92, Tel Aviv.
- Adam B. Jaffe & Manuel Trajtenberg & Rebecca Henderson, 1993. "Geographic Localization of Knowledge Spillovers as Evidenced by Patent Citations," The Quarterly Journal of Economics, Oxford University Press, vol. 108(3), pages 577-598.
- Adam B. Jaffe & Manuel Trajtenberg & Rebecca Henderson, 1992. "Geographic Localization of Knowledge Spillovers as Evidenced by Patent Citations," NBER Working Papers 3993, National Bureau of Economic Research, Inc.
- Hu, Albert Guangzhou, 2004. "Multinational Corporations, Patenting, and Knowledge Flow: The Case of Singapore," Economic Development and Cultural Change, University of Chicago Press, vol. 52(4), pages 781-800, July.
- Manuel Trajtenberg, 1990. "A Penny for Your Quotes: Patent Citations and the Value of Innovations," RAND Journal of Economics, The RAND Corporation, vol. 21(1), pages 172-187, Spring.
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