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How firms innovate through R&D internationalization? An S-curve hypothesis

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  • Chen, Chung-Jen
  • Huang, Yi-Fen
  • Lin, Bou-Wen

Abstract

This article examines the effects of R&D internationalization and organizational slack on innovation performance. We suggest that there is an S-shaped relationship between R&D internationalization and innovation performance. Innovation performance increases in the decentralization stage, decreases in the transition stage, and increases again in the recentralization stage. In addition, organizational slack is hypothesized to have a negative moderating effect on the S-shaped relationship. Longitudinal data on 210 Taiwanese firms in the information technology sector during a 10-year period is collected to test the hypotheses. The findings support our prediction. Managerial implications and future research directions are discussed.

Suggested Citation

  • Chen, Chung-Jen & Huang, Yi-Fen & Lin, Bou-Wen, 2012. "How firms innovate through R&D internationalization? An S-curve hypothesis," Research Policy, Elsevier, vol. 41(9), pages 1544-1554.
  • Handle: RePEc:eee:respol:v:41:y:2012:i:9:p:1544-1554
    DOI: 10.1016/j.respol.2012.06.008
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    Cited by:

    1. René Belderbos & Boris Lokshin & Bert Sadowski, 2015. "The returns to foreign R&D," Journal of International Business Studies, Palgrave Macmillan;Academy of International Business, vol. 46(4), pages 491-504, May.
    2. Leonardo Costa Ribeiro & Márcia Siqueira Rapini & Leandro Alves Silva & Eduardo da Motta e Albuquerque, 2017. "Cross-border co-authorships in scientific articles and knowledge flows: implications for investigating an emerging international system of innovation," Textos para Discussão Cedeplar-UFMG 553, Cedeplar, Universidade Federal de Minas Gerais.
    3. Laurens, Patricia & Le Bas, Christian & Schoen, Antoine & Villard, Lionel & Larédo, Philippe, 2015. "The rate and motives of the internationalisation of large firm R&D (1994–2005): Towards a turning point?," Research Policy, Elsevier, vol. 44(3), pages 765-776.

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