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Luciano Kay

This is information that was supplied by Luciano Kay in registering through RePEc. If you are Luciano Kay, you may change this information at the RePEc Author Service. Or if you are not registered and would like to be listed as well, register at the RePEc Author Service. When you register or update your RePEc registration, you may identify the papers and articles you have authored.

Personal Details

First Name:Luciano
Middle Name:
Last Name:Kay
RePEc Short-ID:pka819
[This author has chosen not to make the email address public]
Atlanta, Georgia (United States)

: 404.894.6822
D. M. Smith Building, Room 107, 685 Cherry Street, Atlanta, GA 30332 - 0345
RePEc:edi:spgatus (more details at EDIRC)
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  1. Kay, Luciano & Youtie, Jan & Shapira, Philip, 2014. "Signs of things to come? What patent submissions by small and medium-sized enterprises say about corporate strategies in emerging technologies," Technological Forecasting and Social Change, Elsevier, vol. 85(C), pages 17-25.
  2. Luciano Kay & Nils Newman & Jan Youtie & Alan L. Porter & Ismael Rafols, 2014. "Patent overlay mapping: Visualizing technological distance," Journal of the Association for Information Science & Technology, Association for Information Science & Technology, vol. 65(12), pages 2432-2443, December.
  3. Jan Youtie & Luciano Kay & Julia Melkers, 2013. "Bibliographic coupling and network analysis to assess knowledge coalescence in a research center environment," Research Evaluation, Oxford University Press, vol. 22(3), pages 145-156, March.
  4. Juan D. Rogers & Jan Youtie & Luciano Kay, 2012. "Program-level assessment of research centers: Contribution of Nanoscale Science and Engineering Centers to US Nanotechnology National Initiative goals," Research Evaluation, Oxford University Press, vol. 21(5), pages 368-380, November.
  5. Philip Shapira & Jan Youtie & Luciano Kay, 2011. "National innovation systems and the globalization of nanotechnology innovation," The Journal of Technology Transfer, Springer, vol. 36(6), pages 587-604, December.

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