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Patent data appendix for quid pro quo: Technology capital transfers for market access in China

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  • Thomas J. Holmes
  • Ellen R. McGrattan
  • Edward C. Prescott

Abstract

Despite the recent rapid development and greater openness of China?s economy, FDI flows between China and technologically advanced countries are relatively small in both directions. We assess global capital flows in light of China?s quid pro quo policy of exchanging market access for transfers of technology capital?accumulated know-how such as research and development (R&D) that can be used in multiple production locations. We first provide empirical evidence of this policy and then incorporate it into a multicountry dynamic general equilibrium model. This extension leads to a significantly better fit of the model to data. We also find large welfare gains for China?and welfare losses for its FDI partners?from quid pro quo.

Suggested Citation

  • Thomas J. Holmes & Ellen R. McGrattan & Edward C. Prescott, 2013. "Patent data appendix for quid pro quo: Technology capital transfers for market access in China," Staff Report 488, Federal Reserve Bank of Minneapolis.
  • Handle: RePEc:fip:fedmsr:488
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    1. Thomas J. Holmes & Ellen R. McGrattan & Edward C. Prescott, 2015. "Quid Pro Quo: Technology Capital Transfers for Market Access in China," The Review of Economic Studies, Review of Economic Studies Ltd, vol. 82(3), pages 1154-1193.
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    Cited by:

    1. Joshua Aizenman, 2015. "Internationalization of the RMB, Capital Market Openness and Financial Reforms in China," Pacific Economic Review, Wiley Blackwell, vol. 20(3), pages 444-460, August.
    2. Krammer, Sorin M.S., 2015. "Do good institutions enhance the effect of technological spillovers on productivity? Comparative evidence from developed and transition economies," Technological Forecasting and Social Change, Elsevier, vol. 94(C), pages 133-154.
    3. Joshua Aizenman, 2015. "Internationalization of the RMB, Capital Market Openness and Financial Reforms in China," Pacific Economic Review, Wiley Blackwell, vol. 20(3), pages 444-460, August.

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