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Structural decomposition of technological domain using patent co-classification and classification hierarchy

Author

Listed:
  • Changbae Mun

    (Hanyang University)

  • Sejun Yoon

    (Hanyang University)

  • Hyunseok Park

    (Hanyang University)

Abstract

This paper proposes a new method for decomposing a technological domain (TD). Specifically, the method identifies sub-TDs at the different levels of technological hierarchy within the TD based on the characteristics of patent co-classification and classification hierarchy. We defined the smallest class, named Minimum Overlapped Class (MOC), constructed by overlaps of sub-group IPC(s) and sub-class UPC(s), and sub-TD is basically identified as a set of the MOCs. In order to cluster the MOCs, technological distances among MOCs are calculated based on patent co-classification and hierarchical structure of patent classification systems. Technologically similar MOCs are grouped by using a hierarchical clustering and the identified clusters at the different level of hierarchy show the hierarchical structure of a TD. Detailed technological content for each sub-TD is represented by extracting representative keywords through a text-mining technique. The method is empirically tested by the solar photovoltaic technology and the results show that the identified sub-TDs are reasonably acceptable by qualitative analysis.

Suggested Citation

  • Changbae Mun & Sejun Yoon & Hyunseok Park, 2019. "Structural decomposition of technological domain using patent co-classification and classification hierarchy," Scientometrics, Springer;Akadémiai Kiadó, vol. 121(2), pages 633-652, November.
    • Handle: RePEc:spr:scient:v:121:y:2019:i:2:d:10.1007_s11192-019-03223-8
    DOI: 10.1007/s11192-019-03223-8
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    Cited by:

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    3. Chie Hoon Song, 2021. "Exploring and Predicting the Knowledge Development in the Field of Energy Storage: Evidence from the Emerging Startup Landscape," Energies, MDPI, vol. 14(18), pages 1-20, September.
    4. Aaldering, Lukas Jan & Song, Chie Hoon, 2021. "Of leaders and laggards - Towards digitalization of the process industries," Technovation, Elsevier, vol. 105(C).

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