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Hydrophilic Coating of Copper Particle Monolayer Wicks for Enhanced Passive Water Transport

Author

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  • Yuki Kameya

    (Department of Mechanical Engineering, Chiba Institute of Technology, 2-17-1 Tsudanuma, Narashino, Chiba 275-0016, Japan)

  • Ryota Osonoe

    (Department of Mechanical Engineering, Chiba Institute of Technology, 2-17-1 Tsudanuma, Narashino, Chiba 275-0016, Japan)

  • Yuto Anjo

    (Department of Mechanical Engineering, Chiba Institute of Technology, 2-17-1 Tsudanuma, Narashino, Chiba 275-0016, Japan)

Abstract

Passive water transport through thin-surface wicks made of heat conducting material is important for developing thermal management devices such as heat pipes and spreaders. In this study, we demonstrated the hydrophilic coating of a Cu particle monolayer wick for enhanced water transport. We fabricated a Cu particle monolayer using Cu powder with a nominal particle diameter of 100 μm and determined the particle size distribution using scanning electron microscopy (SEM). We observed a remarkable change in the water contact angle on the application of a hydrophilic coating, which demonstrated the enhanced passive water transport. The elemental mapping of Cu, O, and Si obtained by electron probe microanalysis confirmed the deposition of the SiO 2 -based coating material on each Cu particle. Although the Cu particles were only partially covered by SiO 2 , a remarkable enhancement in wettability was achieved. Finally, we conducted a rate-of-rise experiment to quantitatively characterize the water transport performance of the coated Cu particle monolayer. Thus, we propose hydrophilic coating as a simple and effective method to enhance passive water transport through Cu particle monolayer wicks.

Suggested Citation

  • Yuki Kameya & Ryota Osonoe & Yuto Anjo, 2020. "Hydrophilic Coating of Copper Particle Monolayer Wicks for Enhanced Passive Water Transport," Energies, MDPI, vol. 13(12), pages 1-10, June.
  • Handle: RePEc:gam:jeners:v:13:y:2020:i:12:p:3294-:d:376741
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    References listed on IDEAS

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    1. Tang, Heng & Tang, Yong & Wan, Zhenping & Li, Jie & Yuan, Wei & Lu, Longsheng & Li, Yong & Tang, Kairui, 2018. "Review of applications and developments of ultra-thin micro heat pipes for electronic cooling," Applied Energy, Elsevier, vol. 223(C), pages 383-400.
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