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Review of applications and developments of ultra-thin micro heat pipes for electronic cooling

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  • Tang, Heng
  • Tang, Yong
  • Wan, Zhenping
  • Li, Jie
  • Yuan, Wei
  • Lu, Longsheng
  • Li, Yong
  • Tang, Kairui

Abstract

The development of miniaturization and high-density packaging of electronic components demands heat dissipation components that are compact and exhibit high performance. An ultra-thin micro heat pipe (UTHP), as a novel heat pipe with a flat shape that is highly suitable for application with high power and limited heat dissipation space, has been extensively investigated and widely used in mobile electronics. Understanding the influence of the manufacturing processes, capillary wick structures and flattened thickness on the thermal performance of UTHPs has been the aim of numerous studies. This paper presents a comprehensive review of the recent developments and applications of UTHPs for thermal management of electronics. The different types and applications of UTHPs are introduced, and the packaging technologies of UTHPs are summarized and compared. Furthermore, the fabrication methodology and heat transfer characteristics of various wick structures used for UTHPs are reviewed and analysed in detail. Finally, the challenges affecting the development and application of UTHPs are outlined, and recommendations for future research are presented.

Suggested Citation

  • Tang, Heng & Tang, Yong & Wan, Zhenping & Li, Jie & Yuan, Wei & Lu, Longsheng & Li, Yong & Tang, Kairui, 2018. "Review of applications and developments of ultra-thin micro heat pipes for electronic cooling," Applied Energy, Elsevier, vol. 223(C), pages 383-400.
    • Handle: RePEc:eee:appene:v:223:y:2018:i:c:p:383-400
    DOI: 10.1016/j.apenergy.2018.04.072
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    References listed on IDEAS

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    11. Zhou, Guohui & Li, Ji & Jia, Zizhou, 2019. "Power-saving exploration for high-end ultra-slim laptop computers with miniature loop heat pipe cooling module," Applied Energy, Elsevier, vol. 239(C), pages 859-875.
    12. Zhang, Shiwei & Chen, Jieling & Sun, Yalong & Li, Jie & Zeng, Jian & Yuan, Wei & Tang, Yong, 2019. "Experimental study on the thermal performance of a novel ultra-thin aluminum flat heat pipe," Renewable Energy, Elsevier, vol. 135(C), pages 1133-1143.
    13. Rashidi, Saman & Hormozi, Faramarz & Sundén, Bengt & Mahian, Omid, 2019. "Energy saving in thermal energy systems using dimpled surface technology – A review on mechanisms and applications," Applied Energy, Elsevier, vol. 250(C), pages 1491-1547.
    14. Wang, Xinyue & Liu, Yang & Tian, Tong & Li, Ji, 2022. "Directly air-cooled compact looped heat pipe module for high power servers with extremely low power usage effectiveness," Applied Energy, Elsevier, vol. 319(C).
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