Advances in latent heat storage technology for electronic cooling

The rapid advancement of electronic and information technologies has led to smaller, more integrated, and smarter devices, resulting in higher packaging densities and increased heat flux in electronic chips. It can degrade performance and cause irreversible damage, impacting the functionality and lifespan of electronic systems. Enhancing instantaneous heat dissipation within limited spaces is crucial for energy efficiency and system sustainability. This study reviews the latest advancements in high-efficiency heat transfer technologies combined with latent heat storage (LHS), focusing on optimizing PCM-assisted cooling and summarizing the applications of LHS in electronic cooling. PCM-assisted cooling technologies significantly enhance the thermal management capabilities of electronic devices. The strategic integration of heat sinks, heat pipes, and fluid circuits effectively addresses thermal loads, improves heat transfer efficiency, and reduces reliance on external cooling mechanisms, providing robust thermal management solutions. Passive cooling methods significantly improve the thermal transfer efficiency of PCMs while active cooling methods offer new avenues for enhancing PCM performance. Therefore, LHS technology shows great potential in the field of electronic cooling, and with ongoing advancements in science and technology. It is expected to be further optimized to provide more efficient thermal management solutions, extending the lifespan and reliability of electronic components. By providing a comprehensive understanding of LHS for electronic cooling, this work aims to inspire innovative thermal management approaches that enhance the reliability and energy efficiency of electronic systems, especially during transient thermal events.