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Digital Twin-based manufacturing system: a survey based on a novel reference model

Author

Listed:
  • Shimin Liu

    (Donghua University
    The Hong Kong Polytechnic University
    The Hong Kong Polytechnic University)

  • Pai Zheng

    (The Hong Kong Polytechnic University
    The Hong Kong Polytechnic University)

  • Jinsong Bao

    (Donghua University)

Abstract

The development of advanced information technologies are paving the digital transformation of manufacturing systems, of which Digital Twin-based manufacturing system (DTMS) has become a prevailing topic attracted ever-increasing concerns from both industry and academia. As a cutting-edge smart manufacturing system, DTMS can improve manufacturing accuracy and efficiency based on high fidelity simulation, near real-time monitoring and control in a cyber-physical integrated manner. However, the connotation and boundary of DTMS lack a clear definition and systematic analysis. Therefore, this paper reviews the existing Digital Twin reference models and implementation architectures on manufacturing system, and further proposes a reference model of DTMS. Based on it, the characteristics and operational mechanism of DTMS are analyzed from three perspectives: hierarchy, dimension, and scale. Specifically, the composition of DTMS is described from a multi-level perspective, the specific characteristics of the DTMS are analyzed from a multi-dimensional perspective, and the temporal and spatial characteristics of the DTMS under different application scenarios are depicted from a multi-scale perspective, respectively. At last, the potential research directions of DTMS are highlighted in terms of reusability, interpretability and adaptability. It is envisioned that this work can provide a clear understanding with insightful knowledge to attract more in-depth research of DTMS.

Suggested Citation

  • Shimin Liu & Pai Zheng & Jinsong Bao, 2024. "Digital Twin-based manufacturing system: a survey based on a novel reference model," Journal of Intelligent Manufacturing, Springer, vol. 35(6), pages 2517-2546, August.
    • Handle: RePEc:spr:joinma:v:35:y:2024:i:6:d:10.1007_s10845-023-02172-7
    DOI: 10.1007/s10845-023-02172-7
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    References listed on IDEAS

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    1. Kendrik Yan Hong Lim & Pai Zheng & Chun-Hsien Chen, 2020. "A state-of-the-art survey of Digital Twin: techniques, engineering product lifecycle management and business innovation perspectives," Journal of Intelligent Manufacturing, Springer, vol. 31(6), pages 1313-1337, August.
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