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An Empirical Study of the Technoparks in Turkey in Investigating the Challenges and Potential of Designing Intelligent Spaces

Author

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  • Serdar Erişen

    (Department of Architecture, Atılım University, Ankara 06830, Turkey)

Abstract

The use of innovative technologies in workspaces, such as the Internet of Things (IoT) and smart systems, has been increasing, yet it remains in the minority of the total number of smart system applications. However, universities and technopoles are part of open innovation that can encourage experimental IoT and smart system projects in places. This research considers the challenges and advantages of developing intelligent environments with smart systems in the Technology Development Zones (TDZs) of Turkey. The growth of Silicon Valley has inspired many technopoles in different countries. Thus, the article includes first a comprehensive survey of the story of Silicon Valley and the emerging technological potential of open and responsible innovation for intelligent spaces and technoparks with rising innovative interest. The study then conducts empirical research in inspecting the performance of TDZs in Turkey. In the research, machine learning and Artificial Intelligence (AI) models are applied in the analyses of critical performance indicators for encouraging incentives and investments in innovative attempts and productivity in TDZs; the challenges, potential, and need for intelligent spaces are evaluated accordingly. This article also reports on the minority of the design staff and the lack of innovation in developing intelligent spaces in the organization of the creative class in Turkey. Consequently, the research proposes a set of implementations for deploying intelligent spaces to be practiced in new and existing TDZs by considering their potential for sustainable and responsible innovation.

Suggested Citation

  • Serdar Erişen, 2023. "An Empirical Study of the Technoparks in Turkey in Investigating the Challenges and Potential of Designing Intelligent Spaces," Sustainability, MDPI, vol. 15(13), pages 1-22, June.
    • Handle: RePEc:gam:jsusta:v:15:y:2023:i:13:p:10150-:d:1180029
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