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The Transient Cooling Performance of a Compact Thin-Film Thermoelectric Cooler with Horizontal Structure

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  • Tingzhen Ming

    (School of Civil Engineering and Architecture, Wuhan University of Technology, Wuhan 430070, China
    Sanya Science and Education Innovation Park, Wuhan University of Technology, Sanya 572004, China)

  • Lijun Liu

    (School of Civil Engineering and Architecture, Wuhan University of Technology, Wuhan 430070, China)

  • Peng Zhang

    (School of Civil Engineering and Architecture, Wuhan University of Technology, Wuhan 430070, China)

  • Yonggao Yan

    (State Key Laboratory of Advanced Technology for Materials Synthesis and Processing, Wuhan University of Technology, Wuhan 430070, China)

  • Yongjia Wu

    (School of Civil Engineering and Architecture, Wuhan University of Technology, Wuhan 430070, China
    Sanya Science and Education Innovation Park, Wuhan University of Technology, Sanya 572004, China)

Abstract

Thermoelectric cooling is an ideal solution for chip heat dissipation due to its characteristics of no refrigerant, no vibration, no moving parts, and easy integration. Compared with a traditional thermoelectric device, a thin-film thermoelectric device significantly improves the cooling density and has tremendous advantages in the temperature control of electronic devices with high-power pulses. In this paper, the transient cooling performance of a compact thin-film thermoelectric cooler with a horizontal structure was studied. A 3D multi-physics field numerical model with the Thomson effect considered was established. And the effects of impulse current, thermoelectric leg length, pulse current imposition time, and the size of the contact thermal resistance on the cooling performance of the device were comprehensively investigated. The results showed that the model achieved an active cooling temperature difference of 25.85 K when an impulse current of 0.26 A was imposed. The longer the length of the thermoelectric leg was, the more unfavorable it was to the chip heat dissipation. Due to the small contact area between different sections of the device, the effect of contact thermal resistance on the cooling performance of the device was moderate.

Suggested Citation

  • Tingzhen Ming & Lijun Liu & Peng Zhang & Yonggao Yan & Yongjia Wu, 2023. "The Transient Cooling Performance of a Compact Thin-Film Thermoelectric Cooler with Horizontal Structure," Energies, MDPI, vol. 16(24), pages 1-14, December.
    • Handle: RePEc:gam:jeners:v:16:y:2023:i:24:p:8109-:d:1301803
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    References listed on IDEAS

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    1. Rama Venkatasubramanian & Edward Siivola & Thomas Colpitts & Brooks O'Quinn, 2001. "Thin-film thermoelectric devices with high room-temperature figures of merit," Nature, Nature, vol. 413(6856), pages 597-602, October.
    2. Sun, Dongfang & Shen, Limei & Sun, Miao & Yao, Yu & Chen, Huanxin & Jin, Shiping, 2018. "An effective method of evaluating the device-level thermophysical properties and performance of micro-thermoelectric coolers," Applied Energy, Elsevier, vol. 219(C), pages 93-104.
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