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Thermal Performance Analysis of Various Heat Sinks Based on Alumina NePCM for Passive Cooling of Electronic Components: An Experimental Study

Author

Listed:
  • Imran Zahid

    (Department of Mechanical Engineering, University of Engineering and Technology, Lahore 39161, Pakistan
    Department of Mechanical Engineering and Technology, Government College University, Faisalabad 38000, Pakistan)

  • Muhammad Farooq

    (Department of Mechanical Engineering, University of Engineering and Technology, Lahore 39161, Pakistan)

  • Muhammad Farhan

    (Department of Mechanical Engineering, University of Engineering and Technology, Lahore 39161, Pakistan)

  • Muhammad Usman

    (Department of Mechanical Engineering, University of Engineering and Technology, Lahore 39161, Pakistan)

  • Adnan Qamar

    (Department of Mechanical Engineering, University of Engineering and Technology, Lahore 39161, Pakistan)

  • Muhammad Imran

    (Department of Mechanical, Biomedical and Design Engineering, College of Engineering and Physical Sciences, Aston University, Birmingham B4 7ET, UK)

  • Mejdal A. Alqahtani

    (Industrial Engineering Department, College of Engineering, King Saud University, P.O. Box 800, Riyadh 11421, Saudi Arabia)

  • Saqib Anwar

    (Industrial Engineering Department, College of Engineering, King Saud University, P.O. Box 800, Riyadh 11421, Saudi Arabia)

  • Muhammad Sultan

    (Department of Agricultural Engineering, Bahauddin Zakariya University, Multan 60800, Pakistan)

  • Muhammad Yasar Javaid

    (Department of Mechanical Engineering and Technology, Government College University, Faisalabad 38000, Pakistan)

Abstract

In the modern digital world, electronic devices are being widely employed for various applications where thermal performance represents a significant technical challenge due to continued miniaturization, high heat generated in the system, and non-uniform high-temperature causing failure. Phase change materials (PCMs) owing to the immense heat of fusion are primarily considered for thermal management, but their insulating properties hedge their applications in electronics cooling. Nano-enhanced phase change materials (NePCMs) have the ability to improve the thermal conductivity of PCM, decrease system temperature and escalate the operating time of devices. Accordingly, the current study focused on the experimental investigations for the thermal performance of three heat sinks (HS) with different configurations such as a simple heat sink (SHS), a square pin-fins heat sink (S pf HS), and Cu foam integrated heat sink (Cu fm HS) with various alumina nanoparticles mass concentrations (0.15, 0.20 and 0.25 wt%) incorporated in PCM (RT-54HC) and at heat flux (0.98–2.94 kW/m 2 ). All HSs reduced the base temperature with the insertion of NePCM compared to the empty SHS. The experimental results identified that the thermal performance of Cu fm HS was found to be superior in reducing base temperature and enhancing working time at two different setpoint temperatures (SPTs). The maximum drop in base temperature was 36.95%, and a 288% maximum working time enhancement was observed for Cu fm HS. Therefore, NePCMs are highly recommended for the thermal management of the electronic cooling system.

Suggested Citation

  • Imran Zahid & Muhammad Farooq & Muhammad Farhan & Muhammad Usman & Adnan Qamar & Muhammad Imran & Mejdal A. Alqahtani & Saqib Anwar & Muhammad Sultan & Muhammad Yasar Javaid, 2022. "Thermal Performance Analysis of Various Heat Sinks Based on Alumina NePCM for Passive Cooling of Electronic Components: An Experimental Study," Energies, MDPI, vol. 15(22), pages 1-16, November.
    • Handle: RePEc:gam:jeners:v:15:y:2022:i:22:p:8416-:d:969136
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    References listed on IDEAS

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    Cited by:

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    3. Shilei Lv & Jiawen Zhu & Ran Wang, 2023. "Experimental Research on a Solar Energy Phase Change Heat Storage Heating System Applied in the Rural Area," Sustainability, MDPI, vol. 15(3), pages 1-20, January.

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