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Nano-engineered thin-film thermoelectric materials enable practical solid-state refrigeration

Author

Listed:
  • Jake Ballard

    (Johns Hopkins University Applied Physics Laboratory (JHUAPL))

  • Matthew Hubbard

    (Johns Hopkins University Applied Physics Laboratory (JHUAPL))

  • Sung-Jin Jung

    (Samsung Electronics)

  • Vanessa Rojas

    (Johns Hopkins University Applied Physics Laboratory (JHUAPL))

  • Richard Ung

    (Johns Hopkins University Applied Physics Laboratory (JHUAPL))

  • Junwoo Suh

    (Samsung Electronics)

  • MinSoo Kim

    (Samsung Electronics)

  • Joonhyun Lee

    (Samsung Electronics)

  • Jonathan M. Pierce

    (Johns Hopkins University Applied Physics Laboratory (JHUAPL))

  • Rama Venkatasubramanian

    (Johns Hopkins University Applied Physics Laboratory (JHUAPL))

Abstract

Refrigeration needs are increasing worldwide with a demand for alternates to bulky poorly scalable vapor compression systems. Here, we demonstrate the first proof of practical solid-state refrigeration, using nano-engineered controlled hierarchically engineered superlattice thin-film thermoelectric materials. With 100%-better thermoelectric materials figure of merit, ZT, than the conventional bulk materials near 300 K, we demonstrate (i) module-level ZT greater than 75% and (ii) a system-level refrigeration ZT 70% better than that of bulk devices. Thin-film thermoelectric modules offer 100–300% better coefficient-of-performance than bulk devices depending on operational scenarios; system-level coefficient-of-performance is ~15 for temperature differentials of 1.3 °C. The thin-film devices enable more heat pumping per P-N couple, relevant for distributed and portable refrigeration, and electronics cooling. Beyond the demonstration of nano-engineered materials for a system-level advantage, we utilize 1/1000th active materials with scalable microelectronic manufacturing. The improved efficiency and ultra-low thermoelectric materials usage herald a new beginning in solid-state refrigeration.

Suggested Citation

  • Jake Ballard & Matthew Hubbard & Sung-Jin Jung & Vanessa Rojas & Richard Ung & Junwoo Suh & MinSoo Kim & Joonhyun Lee & Jonathan M. Pierce & Rama Venkatasubramanian, 2025. "Nano-engineered thin-film thermoelectric materials enable practical solid-state refrigeration," Nature Communications, Nature, vol. 16(1), pages 1-9, December.
    • Handle: RePEc:nat:natcom:v:16:y:2025:i:1:d:10.1038_s41467-025-59698-y
    DOI: 10.1038/s41467-025-59698-y
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    References listed on IDEAS

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    1. Ravi Anant Kishore & Amin Nozariasbmarz & Bed Poudel & Mohan Sanghadasa & Shashank Priya, 2019. "Ultra-high performance wearable thermoelectric coolers with less materials," Nature Communications, Nature, vol. 10(1), pages 1-13, December.
    2. Rama Venkatasubramanian, 2010. "Nanothermal trumpets," Nature, Nature, vol. 463(7281), pages 619-619, February.
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