IDEAS home Printed from https://ideas.repec.org/a/ids/eujine/v5y2011i3p254-271.html
   My bibliography  Save this article

Modelling and analysis of semiconductor manufacturing in a shrinking world: challenges and successes

Author

Listed:
  • Chen-Fu Chien
  • Stephane Dauzere-Peres
  • Hans Ehm
  • John W. Fowler
  • Zhibin Jiang
  • Shekar Krishnaswamy
  • Tae-Eog Lee
  • Lars Monch
  • Reha Uzsoy

Abstract

This paper presents a brief overview of semiconductor manufacturing followed by the results of a panel session held at the Fourth International Conference on Modeling and Analysis of Semiconductor Manufacturing (MASM) in Miami, December 10, 2008 on the role of modelling and analysis in semiconductor manufacturing in a shrinking world. Three participants are from Asia, two from Europe, and two from the USA in addition to the two panel organisers (Fowler and Mönch). At least one panellist from each continent is from industry and one from academia. The statements of the panellists from industry relate to modelling and analysis problems found in their own companies. Those of the academic panellists describe the role that modelling and analysis has played and is expected to play in their semiconductor manufacturing research. Their views on the challenges and successes of modelling and analysis in a globalised world are also included. Finally, we identify some future research challenges for semiconductor manufacturing. [Received: 01 March 2010; Revised: 16 April 2010; Accepted: 01 May 2010]

Suggested Citation

  • Chen-Fu Chien & Stephane Dauzere-Peres & Hans Ehm & John W. Fowler & Zhibin Jiang & Shekar Krishnaswamy & Tae-Eog Lee & Lars Monch & Reha Uzsoy, 2011. "Modelling and analysis of semiconductor manufacturing in a shrinking world: challenges and successes," European Journal of Industrial Engineering, Inderscience Enterprises Ltd, vol. 5(3), pages 254-271.
    • Handle: RePEc:ids:eujine:v:5:y:2011:i:3:p:254-271
    as

    Download full text from publisher

    File URL: http://www.inderscience.com/link.php?id=41616
    Download Restriction: Access to full text is restricted to subscribers.
    ---><---

    As the access to this document is restricted, you may want to search for a different version of it.

    Citations

    Citations are extracted by the CitEc Project, subscribe to its RSS feed for this item.
    as


    Cited by:

    1. Chen-Fu Chien & Chiao-Wen Liu & Shih-Chung Chuang, 2017. "Analysing semiconductor manufacturing big data for root cause detection of excursion for yield enhancement," International Journal of Production Research, Taylor & Francis Journals, vol. 55(17), pages 5095-5107, September.
    2. Allahverdi, Ali & Aydilek, Harun, 2014. "Total completion time with makespan constraint in no-wait flowshops with setup times," European Journal of Operational Research, Elsevier, vol. 238(3), pages 724-734.
    3. Jens Rocholl & Lars Mönch & John Fowler, 2020. "Bi-criteria parallel batch machine scheduling to minimize total weighted tardiness and electricity cost," Journal of Business Economics, Springer, vol. 90(9), pages 1345-1381, November.

    Corrections

    All material on this site has been provided by the respective publishers and authors. You can help correct errors and omissions. When requesting a correction, please mention this item's handle: RePEc:ids:eujine:v:5:y:2011:i:3:p:254-271. See general information about how to correct material in RePEc.

    If you have authored this item and are not yet registered with RePEc, we encourage you to do it here. This allows to link your profile to this item. It also allows you to accept potential citations to this item that we are uncertain about.

    We have no bibliographic references for this item. You can help adding them by using this form .

    If you know of missing items citing this one, you can help us creating those links by adding the relevant references in the same way as above, for each refering item. If you are a registered author of this item, you may also want to check the "citations" tab in your RePEc Author Service profile, as there may be some citations waiting for confirmation.

    For technical questions regarding this item, or to correct its authors, title, abstract, bibliographic or download information, contact: Sarah Parker (email available below). General contact details of provider: http://www.inderscience.com/browse/index.php?journalID=210 .

    Please note that corrections may take a couple of weeks to filter through the various RePEc services.

    IDEAS is a RePEc service. RePEc uses bibliographic data supplied by the respective publishers.