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Phase Field Modeling of Ghost Diffusion in Sn-Ag-Cu Solder Joints

Author

Listed:
  • Naveen Weerasekera

    (University of Louisville, USA)

  • Siyua Cao

    (Portland State University, USA)

  • Dawa Ram Shingdon

    (Nagoya University, Japan)

Abstract

In this paper, we have introduced a phase field modeling technique to simulate ghost diffusion phenomena of intermetallic compounds in a bulk mettalic matrix phase. We used Zenner-Frank phase field approach to define free energy density functional which is to be evolved using Chan-Hilliard and Alan-Chan equations to simulate time evolution of the precipitates. We verified our simulation results with intermetallic compound growth of Sn-Ag-Cu solder joints in isothermal aging process attributing to the diffusion of Ag3Sn intermetallic compound. Herewith we present that Zenner-Frank model demonstrates sound validity and provides a best understanding of such phenomena.

Suggested Citation

Handle: RePEc:epw:physic:v:4:y:2022:i:2:id:11163
DOI: 10.24018/ejphysics.2022.4.2.163
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