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Stabilizing Cu0-Cuδ+ sites via ohmic contact interface engineering for ampere-level nitrate electroreduction to ammonia

Author

Listed:
  • Zeyu Li

    (Harbin Institute of Technology)

  • Ming Zheng

    (Harbin Institute of Technology)

  • Chunshuang Yan

    (Harbin Institute of Technology)

  • Dongqi Yang

    (The University of Texas at Austin)

  • Ruyu Yang

    (University of Science and Technology of China)

  • Chu Zhang

    (Harbin Institute of Technology)

  • Hengjie Liu

    (University of Science and Technology of China)

  • Pin Song

    (Anhui Normal University)

  • Chenhui Yin

    (School of Chemistry and Chemical Engineering)

  • Zeming Qi

    (University of Science and Technology of China)

  • Daobin Liu

    (University of Science and Technology of China)

  • Xin Zhou

    (Harbin Institute of Technology)

  • Li Song

    (University of Science and Technology of China)

  • Chade Lv

    (Harbin Institute of Technology)

  • Guihua Yu

    (The University of Texas at Austin)

Abstract

The synergistic Cu0-Cuδ+ sites are found as the active sites for NH3 synthesis through nitrate electroreduction reaction, but still face significant challenges in stabilizing the Cuδ+ due to its self-reduction. Here we propose an Ohmic contact interface engineering strategy by loading copper nano-islands on indium hydroxide nanocubes. Attributed to the lower work function of Cu than that of In(OH)3 with n-type semiconductor nature, the electrons in Cu can transfer unimpededly to In(OH)3 at the interface of Ohmic junction, triggering and stabilizing polarized Cu0-Cuδ+ active sites. Cu@In(OH)3 sustains both high NH3 yield rate (4.28 mmol h−1 mgcat.−1) and Faradaic efficiency (97.35%) at −0.6 V vs. RHE, while maintaining stability for at least 120 h under an Ampere-level of 800 mA cm−2. Such Ohmic contact interface engineering approach allows for simultaneously constructing and stabilizing the Cu0-Cuδ+ for the electrosynthesis of ammonia, as well as other value-added chemicals relying on above active sites.

Suggested Citation

  • Zeyu Li & Ming Zheng & Chunshuang Yan & Dongqi Yang & Ruyu Yang & Chu Zhang & Hengjie Liu & Pin Song & Chenhui Yin & Zeming Qi & Daobin Liu & Xin Zhou & Li Song & Chade Lv & Guihua Yu, 2025. "Stabilizing Cu0-Cuδ+ sites via ohmic contact interface engineering for ampere-level nitrate electroreduction to ammonia," Nature Communications, Nature, vol. 16(1), pages 1-13, December.
    • Handle: RePEc:nat:natcom:v:16:y:2025:i:1:d:10.1038_s41467-025-63996-w
    DOI: 10.1038/s41467-025-63996-w
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