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Staging Problem of a Dual Delivery Pick-and-Place Machine in Printed Circuit Card Assembly

Author

Listed:
  • Reza H. Ahmadi

    (University of California, Los Angeles, California)

  • Panagiotis Kouvelis

    (Duke University, Durham, North Carolina)

Abstract

This paper addresses a material staging problem arising from a dual delivery pick-and-place machine that is used for the assembly of printed circuit boards where components are attached using “surface mount technology.” The staging problem of such machines involves allocation of component feeders to its two-feeder carriers along with the corresponding sets of vacuum nozzles to dispense the components. The usual managerial objective for the staging problem is minimization of the total time required to populate the circuit boards, i.e., the pick-and-place machine's cycle time. For the dual delivery pick-and-place machines this implies minimization of the workload imbalance between the two carriers and reduction of the number of vacuum nozzle changes required. In this paper, we develop algorithms to optimally solve the single and multiple product staging problem for the above managerial objectives.

Suggested Citation

  • Reza H. Ahmadi & Panagiotis Kouvelis, 1994. "Staging Problem of a Dual Delivery Pick-and-Place Machine in Printed Circuit Card Assembly," Operations Research, INFORMS, vol. 42(1), pages 81-91, February.
    • Handle: RePEc:inm:oropre:v:42:y:1994:i:1:p:81-91
    DOI: 10.1287/opre.42.1.81
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    Citations

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    Cited by:

    1. Crama, Yves & Flippo, Olaf E. & van de Klundert, Joris & Spieksma, Frits C. R., 1997. "The assembly of printed circuit boards: A case with multiple machines and multiple board types," European Journal of Operational Research, Elsevier, vol. 98(3), pages 457-472, May.
    2. Spieksma, F.C.R. & Crama, Y. & van de Klundert, J. & Flippo, O.E., 1995. "The assembly of printed circuit boards: a case with multiple machines and multiple board types," Research Memorandum 023, Maastricht University, Maastricht Research School of Economics of Technology and Organization (METEOR).
    3. Tommaso Schettini & Federico Malucelli & Helena Ramalhinho, 2023. "Scheduling a pick and place packaging line," Journal of Scheduling, Springer, vol. 26(2), pages 113-136, April.
    4. Altinkemer, Kemal & Kazaz, Burak & Koksalan, Murat & Moskowitz, Herbert, 2000. "Optimization of printed circuit board manufacturing: Integrated modeling and algorithms," European Journal of Operational Research, Elsevier, vol. 124(2), pages 409-421, July.
    5. Sun, Dong-Seok & Lee, Tae-Eog & Kim, Kyung-Hoon, 2005. "Component allocation and feeder arrangement for a dual-gantry multi-head surface mounting placement tool," International Journal of Production Economics, Elsevier, vol. 95(2), pages 245-264, February.
    6. George J. Kyparisis & Christos Koulamas, 2002. "Assembly-Line Scheduling with Concurrent Operations and Parallel Machines," INFORMS Journal on Computing, INFORMS, vol. 14(1), pages 68-80, February.

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