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The Quality Test of Wire Bonding

Author

Listed:
  • Caiyuan Wang
  • Ronglu Sun

Abstract

The reliability of the IC chip during performance of its function in any application is very much dependant on the quality of the wire bond interconnection. If the quality of the wire bond interconnection is poor and not consistent, it has a significant impact on the reliability and dependability of the device. The quality of a wire bond is determined by the strength of the interfaces between the bond wire and the bond pad as well as the bond wire and the lead finger. In this article, we discuss in detail established methodologies such as bond pull test, bond shear test, visual inspection and some special test of quality.

Suggested Citation

  • Caiyuan Wang & Ronglu Sun, 2009. "The Quality Test of Wire Bonding," Modern Applied Science, Canadian Center of Science and Education, vol. 3(12), pages 1-50, December.
    • Handle: RePEc:ibn:masjnl:v:3:y:2009:i:12:p:50
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    More about this item

    JEL classification:

    • R00 - Urban, Rural, Regional, Real Estate, and Transportation Economics - - General - - - General
    • Z0 - Other Special Topics - - General

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