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A Dynamic Dispatching Method for Large-Scale Interbay Material Handling Systems of Semiconductor FAB

Author

Listed:
  • Beixin Xia

    (School of Management, Shanghai University, Shanghai 200444, China)

  • Tong Tian

    (School of Management, Shanghai University, Shanghai 200444, China)

  • Yan Gao

    (School of Communication, East China University of Political Science and Law, Shanghai 201620, China)

  • Mingyue Zhang

    (School of Management, Shanghai University, Shanghai 200444, China)

  • Yunfang Peng

    (School of Management, Shanghai University, Shanghai 200444, China)

Abstract

Interbay Automated Material Handling Systems (AMHS) are widely adopted especially in Semiconductor Wafer Fabrication Systems (SWFS). The dispatching method plays a major role in the control of AMHS. This paper proposes an efficient multi-objective dynamic dispatching method which will dynamically adjust vehicle-load assignments according to the real-time situation of the system. A multi-objective cost function with variable weights is established, taking into account various performance indices (i.e., transport time, throughput, cycle time, vehicle utilization, movement, and waiting time), and the corresponding mathematical model is formulated. Then, in order to obtain the suitable weights according to the real-time condition, an advanced method is developed based on fuzzy theory. After that, a Hungarian algorithm is adopted to solve the model. Finally, simulations are conducted to validate the proposed method. The results demonstrate that it has better comprehensive performance compared to the previous dispatching methods.

Suggested Citation

  • Beixin Xia & Tong Tian & Yan Gao & Mingyue Zhang & Yunfang Peng, 2022. "A Dynamic Dispatching Method for Large-Scale Interbay Material Handling Systems of Semiconductor FAB," Sustainability, MDPI, vol. 14(21), pages 1-19, October.
  • Handle: RePEc:gam:jsusta:v:14:y:2022:i:21:p:13882-:d:953197
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    References listed on IDEAS

    as
    1. Qi Zhou & Bing-Hai Zhou, 2018. "An impending deadlock-free scheduling method in the case of unified automated material handling systems in 300 mm wafer fabrications," Journal of Intelligent Manufacturing, Springer, vol. 29(1), pages 155-164, January.
    2. Junliang Wang & Jie Zhang, 2016. "Big data analytics for forecasting cycle time in semiconductor wafer fabrication system," International Journal of Production Research, Taylor & Francis Journals, vol. 54(23), pages 7231-7244, December.
    3. Hyun Joong Yoon & Junjae Chae, 2019. "Simulation Study for Semiconductor Manufacturing System: Dispatching Policies for a Wafer Test Facility," Sustainability, MDPI, vol. 11(4), pages 1-21, February.
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    Cited by:

    1. Jiang Yao & Zhiqiang Wang & Hongbin Chen & Weigang Hou & Xiaomiao Zhang & Xu Li & Weixing Yuan, 2023. "Open-Pit Mine Truck Dispatching System Based on Dynamic Ore Blending Decisions," Sustainability, MDPI, vol. 15(4), pages 1-12, February.

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