IDEAS home Printed from https://ideas.repec.org/a/gam/jeners/v10y2017i3p341-d92746.html
   My bibliography  Save this article

High Performance Silicon Carbide Power Packaging—Past Trends, Present Practices, and Future Directions

Author

Listed:
  • Sayan Seal

    (Department of Electrical Engineering, University of Arkansas, Fayetteville, AR 72701, USA)

  • Homer Alan Mantooth

    (Department of Electrical Engineering, University of Arkansas, Fayetteville, AR 72701, USA)

Abstract

This paper presents a vision for the future of 3D packaging and integration of silicon carbide (SiC) power modules. Several major achievements and novel architectures in SiC modules from the past and present have been highlighted. Having considered these advancements, the major technology barriers preventing SiC power devices from performing to their fullest ability were identified. 3D wire bondless approaches adopted for enhancing the performance of silicon power modules were surveyed, and their merits were assessed to serve as a vision for the future of SiC power packaging. Current efforts pursuing 3D wire bondless SiC power modules were described, and the concept for a novel SiC power module was discussed.

Suggested Citation

  • Sayan Seal & Homer Alan Mantooth, 2017. "High Performance Silicon Carbide Power Packaging—Past Trends, Present Practices, and Future Directions," Energies, MDPI, vol. 10(3), pages 1-30, March.
    • Handle: RePEc:gam:jeners:v:10:y:2017:i:3:p:341-:d:92746
    as

    Download full text from publisher

    File URL: https://www.mdpi.com/1996-1073/10/3/341/pdf
    Download Restriction: no
    File URL: https://www.mdpi.com/1996-1073/10/3/341/
    Download Restriction: no
    ---><---

    Citations

    Citations are extracted by the CitEc Project, subscribe to its RSS feed for this item.
    as


    Cited by:

    1. Omar Sarwar Chaudhary & Mouloud Denaï & Shady S. Refaat & Georgios Pissanidis, 2023. "Technology and Applications of Wide Bandgap Semiconductor Materials: Current State and Future Trends," Energies, MDPI, vol. 16(18), pages 1-27, September.
    2. Fernando Acosta-Cambranis & Jordi Zaragoza & Luis Romeral & Néstor Berbel, 2020. "Comparative Analysis of SVM Techniques for a Five-Phase VSI Based on SiC Devices," Energies, MDPI, vol. 13(24), pages 1-25, December.
    3. Matallana, A. & Ibarra, E. & López, I. & Andreu, J. & Garate, J.I. & Jordà, X. & Rebollo, J., 2019. "Power module electronics in HEV/EV applications: New trends in wide-bandgap semiconductor technologies and design aspects," Renewable and Sustainable Energy Reviews, Elsevier, vol. 113(C), pages 1-1.
    4. Andressa Nakahata-Medrado & Jean-Luc Schanen & Jean-Michel Guichon & Pierre-Olivier Jeannin & Emmanuel Batista & Guillaume Desportes, 2021. "Optimization of a Gate Distribution Layout to Compensate the Current Imbalance Generated by the 3D Geometry of a Railway Inverter," Energies, MDPI, vol. 14(7), pages 1-18, March.
    5. Ali Roshanghias & Perla Malago & Jaroslaw Kaczynski & Timothy Polom & Jochen Bardong & Dominik Holzmann & Muhammad-Hassan Malik & Michael Ortner & Christina Hirschl & Alfred Binder, 2021. "Sinterconnects: All-Copper Top-Side Interconnects Based on Copper Sinter Paste for Power Module Packaging," Energies, MDPI, vol. 14(8), pages 1-13, April.

    Corrections

    All material on this site has been provided by the respective publishers and authors. You can help correct errors and omissions. When requesting a correction, please mention this item's handle: RePEc:gam:jeners:v:10:y:2017:i:3:p:341-:d:92746. See general information about how to correct material in RePEc.

    If you have authored this item and are not yet registered with RePEc, we encourage you to do it here. This allows to link your profile to this item. It also allows you to accept potential citations to this item that we are uncertain about.

    We have no bibliographic references for this item. You can help adding them by using this form .

    If you know of missing items citing this one, you can help us creating those links by adding the relevant references in the same way as above, for each refering item. If you are a registered author of this item, you may also want to check the "citations" tab in your RePEc Author Service profile, as there may be some citations waiting for confirmation.

    For technical questions regarding this item, or to correct its authors, title, abstract, bibliographic or download information, contact: MDPI Indexing Manager (email available below). General contact details of provider: https://www.mdpi.com .

    Please note that corrections may take a couple of weeks to filter through the various RePEc services.

    IDEAS is a RePEc service. RePEc uses bibliographic data supplied by the respective publishers.