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On-Line Junction Temperature Monitoring of Switching Devices with Dynamic Compact Thermal Models Extracted with Model Order Reduction

Author

Listed:
  • Fabio Di Napoli

    (Department of Electrical Engineering and Information Technology, University Federico II, via Claudio 21, 80125 Naples, Italy)

  • Alessandro Magnani

    (Department of Electrical Engineering and Information Technology, University Federico II, via Claudio 21, 80125 Naples, Italy)

  • Marino Coppola

    (Department of Electrical Engineering and Information Technology, University Federico II, via Claudio 21, 80125 Naples, Italy)

  • Pierluigi Guerriero

    (Department of Electrical Engineering and Information Technology, University Federico II, via Claudio 21, 80125 Naples, Italy)

  • Vincenzo D’Alessandro

    (Department of Electrical Engineering and Information Technology, University Federico II, via Claudio 21, 80125 Naples, Italy)

  • Lorenzo Codecasa

    (Department of Electronics, Information, and Bioengineering, Politecnico di Milano, 20133 Milan, Italy)

  • Pietro Tricoli

    (School of Electronic, Electrical and Systems Engineering, University of Birmingham, Birmingham B15 2TT, UK)

  • Santolo Daliento

    (Department of Electrical Engineering and Information Technology, University Federico II, via Claudio 21, 80125 Naples, Italy)

Abstract

Residual lifetime estimation has gained a key point among the techniques that improve the reliability and the efficiency of power converters. The main cause of failures are the junction temperature cycles exhibited by switching devices during their normal operation; therefore, reliable power converter lifetime estimation requires the knowledge of the junction temperature time profile. Since on-line dynamic temperature measurements are extremely difficult, in this work an innovative real-time monitoring strategy is proposed, which is capable of estimating the junction temperature profile from the measurement of the dissipated powers through an accurate and compact thermal model of the whole power module. The equations of this model can be easily implemented inside a FPGA, exploiting the control architecture already present in modern power converters. Experimental results on an IGBT power module demonstrate the reliability of the proposed method.

Suggested Citation

  • Fabio Di Napoli & Alessandro Magnani & Marino Coppola & Pierluigi Guerriero & Vincenzo D’Alessandro & Lorenzo Codecasa & Pietro Tricoli & Santolo Daliento, 2017. "On-Line Junction Temperature Monitoring of Switching Devices with Dynamic Compact Thermal Models Extracted with Model Order Reduction," Energies, MDPI, vol. 10(2), pages 1-14, February.
    • Handle: RePEc:gam:jeners:v:10:y:2017:i:2:p:189-:d:89741
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    References listed on IDEAS

    as
    1. d'Alessandro, Vincenzo & Di Napoli, Fabio & Guerriero, Pierluigi & Daliento, Santolo, 2015. "An automated high-granularity tool for a fast evaluation of the yield of PV plants accounting for shading effects," Renewable Energy, Elsevier, vol. 83(C), pages 294-304.
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    Cited by:

    1. Issam A. Smadi & Saher Albatran & Hamzeh J. Ahmad, 2018. "On the Performance Optimization of Two-Level Three-Phase Grid-Feeding Voltage-Source Inverters," Energies, MDPI, vol. 11(2), pages 1-17, February.
    2. Michał Szulborski & Sebastian Łapczyński & Łukasz Kolimas & Daniel Zalewski, 2021. "Transient Thermal Analysis of the Circuit Breaker Current Path with the Use of FEA Simulation," Energies, MDPI, vol. 14(9), pages 1-24, April.
    3. Michał Szulborski & Sebastian Łapczyński & Łukasz Kolimas & Łukasz Kozarek & Desire Dauphin Rasolomampionona & Tomasz Żelaziński & Adam Smolarczyk, 2021. "Transient Thermal Analysis of NH000 gG 100A Fuse Link Employing Finite Element Method," Energies, MDPI, vol. 14(5), pages 1-18, March.
    4. Krzysztof Górecki, 2021. "Influence of the Semiconductor Devices Cooling Conditions on Characteristics of Selected DC–DC Converters," Energies, MDPI, vol. 14(6), pages 1-16, March.
    5. Adrian Plesca, 2019. "Thermal Analysis of Power Semiconductor Device in Steady-State Conditions," Energies, MDPI, vol. 13(1), pages 1-18, December.
    6. Michał Szulborski & Sebastian Łapczyński & Łukasz Kolimas, 2021. "Thermal Analysis of Heat Distribution in Busbars during Rated Current Flow in Low-Voltage Industrial Switchgear," Energies, MDPI, vol. 14(9), pages 1-23, April.

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