Author
Listed:
- R. S. Ch Murthy Chodisetty
(Vardhaman College of Engineering)
- Y. Suryanarayana Murthy
(Vardhaman College of Engineering)
- S. S. Prasada Rao
(SP Mandali’s Prin. LN Welingkar Institute of Management Development and Research)
- D. Sudarsana Murthy
(Brainware University)
- S. Venkata Siva Kumar
(Vardhaman College of Engineering)
Abstract
This study investigates the dynamic relationship between organizational healing components—leadership, communication, culture, and employee engagement—and their impact on employee well-being by drawing analogies from biological processes such as inflammation, proliferation, and remodelling. Using a mixed-methods approach that integrates surveys, interviews, and focus groups, the research uncovers how effective leadership styles and open communication significantly enhance job satisfaction and mental health. A supportive organizational culture was found to positively influence employee engagement, which mediates the effects of other healing factors, amplifying their influence on overall well-being. Statistical tools like structural equation modeling revealed strong correlations among these variables, confirming their interconnected roles. Practical implications highlight the need for organizations to invest in leadership development, transparent communication channels, and a healthy workplace culture to foster resilience and productivity. The study contributes a novel conceptual framework that aligns organizational healing with employee-centric outcomes, offering strategic pathways for sustainable growth. Through its biological metaphors and comprehensive methodology, the research redefines how enterprises can nurture thriving workforces.
Suggested Citation
R. S. Ch Murthy Chodisetty & Y. Suryanarayana Murthy & S. S. Prasada Rao & D. Sudarsana Murthy & S. Venkata Siva Kumar, 2025.
"A Comprehensive Study of the Elements of Organizational Healing and Their Impact on Employee Well-Being,"
Springer Proceedings in Business and Economics,,
Springer.
Handle:
RePEc:spr:prbchp:978-981-96-8582-0_3
DOI: 10.1007/978-981-96-8582-0_3
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