CowSSL: contrastive open-world semi-supervised learning for wafer bin map
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DOI: 10.1007/s10845-024-02351-0
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References listed on IDEAS
- Cheng Hao Jin & Hyun-Jin Kim & Yongjun Piao & Meijing Li & Minghao Piao, 2020. "Wafer map defect pattern classification based on convolutional neural network features and error-correcting output codes," Journal of Intelligent Manufacturing, Springer, vol. 31(8), pages 1861-1875, December.
- Chia-Yu Hsu & Ju-Chien Chien, 2022. "Ensemble convolutional neural networks with weighted majority for wafer bin map pattern classification," Journal of Intelligent Manufacturing, Springer, vol. 33(3), pages 831-844, March.
- Seokho Kang, 2020. "Joint modeling of classification and regression for improving faulty wafer detection in semiconductor manufacturing," Journal of Intelligent Manufacturing, Springer, vol. 31(2), pages 319-326, February.
- Seyoung Park & Jaeyeon Jang & Chang Ouk Kim, 2021. "Discriminative feature learning and cluster-based defect label reconstruction for reducing uncertainty in wafer bin map labels," Journal of Intelligent Manufacturing, Springer, vol. 32(1), pages 251-263, January.
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Keywords
Semiconductor manufacturing; Defect patterns classification; Wafer bin map; Open-world recognition; Semi-supervised learning; Contrastive learning;All these keywords.
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