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An in-situ assembled cobweb-like adhesive with high processability

Author

Listed:
  • Xiaoming Xie

    (Xinzhou Normal University
    South China Normal University)

  • Runhan Li

    (South China Normal University)

  • Yongsheng Qiao

    (Xinzhou Normal University)

  • Jiaqi Zhang

    (University of Missouri)

  • Zilin Zhang

    (Xinzhou Normal University)

  • Xingyu Xu

    (Xinzhou Normal University)

  • Jie Yang

    (Xinzhou Normal University)

  • Yan-Yu Peng

    (South China Normal University)

  • Yifa Chen

    (South China Normal University)

  • Shun-Li Li

    (South China Normal University)

  • Ya-Qian Lan

    (South China Normal University)

Abstract

Low temperature tolerant adhesive with high flexibility and adhesion strength is highly desired yet challenging owing to the presence of obvious volume shrinkage, increased brittleness, and reduced transmission of mechanical stress at low temperature. Inspired by the cobweb, we hereby develop a kind of flexible adhesive that can be used at low temperature by in-situ polymerization of disulfide bond-based polymer with polyoxometalate. This low-temperature tolerant adhesive presents high flexibility and adhesion strength, good processability and reversible adhesion ability, a wide tolerable temperature range (i.e., −196 to 50 °C), and a long-lasting adhesion effect (>80 days, −196 °C) that is significantly better than commercial solvent-free adhesives. The adhesive can be processed into high-strength cobwebs, injected into tiny tube models, and adhered onto complicated interfaces. Notably, it enables to be kilogram-scale produced through a solvent-free method, holding promise for potential utilization in fields like repairing artifacts or precision instruments with micro-fractures at low temperature.

Suggested Citation

  • Xiaoming Xie & Runhan Li & Yongsheng Qiao & Jiaqi Zhang & Zilin Zhang & Xingyu Xu & Jie Yang & Yan-Yu Peng & Yifa Chen & Shun-Li Li & Ya-Qian Lan, 2025. "An in-situ assembled cobweb-like adhesive with high processability," Nature Communications, Nature, vol. 16(1), pages 1-9, December.
  • Handle: RePEc:nat:natcom:v:16:y:2025:i:1:d:10.1038_s41467-025-60076-x
    DOI: 10.1038/s41467-025-60076-x
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    References listed on IDEAS

    as
    1. Guangxu Yang & Zhenggang Gong & Xiaolin Luo & Lihui Chen & Li Shuai, 2023. "Bonding wood with uncondensed lignins as adhesives," Nature, Nature, vol. 621(7979), pages 511-515, September.
    2. Clayton R. Westerman & Bradley C. McGill & Jonathan J. Wilker, 2023. "Sustainably sourced components to generate high-strength adhesives," Nature, Nature, vol. 621(7978), pages 306-311, September.
    Full references (including those not matched with items on IDEAS)

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