IDEAS home Printed from https://ideas.repec.org/a/gam/jagris/v13y2023i12p2230-d1292597.html
   My bibliography  Save this article

Stress Simulation on Cam-Type Transplanting Device of Semiautomatic Vegetable Transplanter

Author

Listed:
  • Sri Markumningsih

    (Department of Agricultural and Biosystems Engineering, Faculty of Agricultural Technology, Universitas Gadjah Mada, Yogyakarta 55281, Indonesia
    These authors contributed equally to this work.)

  • Seok-Joon Hwang

    (Department of Biosystems Engineering, Kangwon National University, Chuncheon 24341, Republic of Korea
    Interdisciplinary Program in Smart Agriculture, Kangwon National University, Chuncheon 24341, Republic of Korea
    These authors contributed equally to this work.)

  • Jeong-Hun Kim

    (Department of Biosystems Engineering, Kangwon National University, Chuncheon 24341, Republic of Korea
    Interdisciplinary Program in Smart Agriculture, Kangwon National University, Chuncheon 24341, Republic of Korea)

  • Moon-Kyeong Jang

    (Department of Biosystems Engineering, Kangwon National University, Chuncheon 24341, Republic of Korea
    Interdisciplinary Program in Smart Agriculture, Kangwon National University, Chuncheon 24341, Republic of Korea)

  • Ju-Seok Nam

    (Department of Biosystems Engineering, Kangwon National University, Chuncheon 24341, Republic of Korea
    Interdisciplinary Program in Smart Agriculture, Kangwon National University, Chuncheon 24341, Republic of Korea)

Abstract

Stress measurements play a crucial role in safety analyses of transplanting devices. Strain gauges for stress measurements during field tests can be expensive and time-consuming. The aim of this study was to investigate the stress on the transplanting device of a cam-type semiautomatic vegetable transplanter using a simulation method. A three-dimensional simulation model was established, considering the dimensions and material properties of the transplanting device. The stress distribution and maximum stress values were obtained through simulations. The maximum stress values at 15 points within the transplanting device determined via the simulation were compared with the experimental stress data to verify the stress simulation model. The results show that the maximum stress obtained from the simulation correlated with that of the measured results, although differences were observed at different locations, particularly at strain gauge positions 11 and 13. Based on the simulation results, the maximum stress occurs at the upper link of the cam-type transplanting device, reaching a magnitude of 201.21 MPa, and the static safety factor is 1.04.

Suggested Citation

  • Sri Markumningsih & Seok-Joon Hwang & Jeong-Hun Kim & Moon-Kyeong Jang & Ju-Seok Nam, 2023. "Stress Simulation on Cam-Type Transplanting Device of Semiautomatic Vegetable Transplanter," Agriculture, MDPI, vol. 13(12), pages 1-13, December.
  • Handle: RePEc:gam:jagris:v:13:y:2023:i:12:p:2230-:d:1292597
    as

    Download full text from publisher

    File URL: https://www.mdpi.com/2077-0472/13/12/2230/pdf
    Download Restriction: no

    File URL: https://www.mdpi.com/2077-0472/13/12/2230/
    Download Restriction: no
    ---><---

    Corrections

    All material on this site has been provided by the respective publishers and authors. You can help correct errors and omissions. When requesting a correction, please mention this item's handle: RePEc:gam:jagris:v:13:y:2023:i:12:p:2230-:d:1292597. See general information about how to correct material in RePEc.

    If you have authored this item and are not yet registered with RePEc, we encourage you to do it here. This allows to link your profile to this item. It also allows you to accept potential citations to this item that we are uncertain about.

    We have no bibliographic references for this item. You can help adding them by using this form .

    If you know of missing items citing this one, you can help us creating those links by adding the relevant references in the same way as above, for each refering item. If you are a registered author of this item, you may also want to check the "citations" tab in your RePEc Author Service profile, as there may be some citations waiting for confirmation.

    For technical questions regarding this item, or to correct its authors, title, abstract, bibliographic or download information, contact: MDPI Indexing Manager (email available below). General contact details of provider: https://www.mdpi.com .

    Please note that corrections may take a couple of weeks to filter through the various RePEc services.

    IDEAS is a RePEc service. RePEc uses bibliographic data supplied by the respective publishers.