Author
Listed:
- Prashanth Palani Velayuda Shanmugasundram, Hari
- Jayamani, Elammaran
- Soon, Kok Heng
Abstract
This work offers a bibliographic review in the field of biopolymer composite fabrication that seeks bio-based polymers and other materials currently used in the electrical and electronics industries. Highly acclaimed polymers, including synthetic polymers, have been included in this review and their dielectric properties are critically reviewed. In addition, this review consists of all the classified biopolymers that have been used for dielectric applications and the potential filler materials have been thoroughly discussed. Existing dielectric theories, mathematical models and polarization phenomenon related to dielectric polymer composites have been visually represented and factually explained for the betterment of conceptual understanding and experimental evaluations. In an ever-growing material science discipline, this review analysis has covered the potential use of biopolymers, organoclays, and other fillers that may ensemble together to perform in the electronics industry. The limitations involved in this analysis, optimization in methods of fabrication and views related to future direction of polymer composite research has been suggested. Furthermore, the practical approach for functionalization of filler materials and their ethical use in industry for reducing waste products have been considered in this review. Furthermore, this review offers a vivid perspective of using cleaner methods of production, fabrication and usage of materials that encompasses green polymers, fillers with low carbon footprint and sustainable incorporation of chemical products were assessed for their application in microelectronics.
Suggested Citation
Prashanth Palani Velayuda Shanmugasundram, Hari & Jayamani, Elammaran & Soon, Kok Heng, 2025.
"Review: Classification, theories, and methodologies concerning bio-based polymer dielectric composites,"
Renewable and Sustainable Energy Reviews, Elsevier, vol. 209(C).
Handle:
RePEc:eee:rensus:v:209:y:2025:i:c:s1364032124007524
DOI: 10.1016/j.rser.2024.115026
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