A hybrid pump-driven phase-change cooling system incorporating capillary evaporation and liquid-gas ejection for thermal management of high-heat-flux chip arrays

Due to its high heat transfer efficiency and excellent temperature uniformity, liquid-gas phase-change cooling technology has emerged as a promising solution for the thermal management of high-power chip arrays. However, conventional phase-change heat exchangers for chip arrays often suffer from drawbacks such as uneven flow distribution and unstable boiling behavior. To address these limitations, this study innovatively proposes a novel synergistic phase-change cooling system that integrates pump-driven circulation, capillary evaporation, and liquid-gas ejection. This design enables directional refrigerant transport and stable evaporation/boiling within the chip array heat source region. Experimental results demonstrate that, under test conditions involving a 4×4 chip array (with each chip measuring 0.5 × 0.5 cm) and a chip heat flux of 360.1 W·cm−2, the system maintains the maximum chip temperature below 78°C, with a temperature standard deviation of only 1.19°C across the array. Furthermore, it exhibits superior flow stability and temperature response characteristics. This design offers a new insights and reference for the thermal management of high-power chip arrays.