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Control Charts for Particles in the Semiconductor Manufacturing Process

Author

Listed:
  • Kawamura Hironobu
  • Nishina Ken

    (Department of Industrial Management Engineering, Nagoya Institute of Technology, Gokiso-cho, Showa-ku, Nagoya, Aichi 466-8555, Japan)

  • Higashide Masanobu

    (Reliability and Quality Control Department, Manufacturing Operations Unit, NEC Electronics Corporation, 1753, Shimonumabe, Nakahara-Ku, Kawasaki, Kanagawa 211-8668, Japan)

Abstract

Particles such as dust have serious negative effects on yield, performance and reliability in the semiconductor manufacturing process. As a result, there is the need to control particles in the manufacturing process, which often is done by means of control charts. The c-chart is a control chart based on the Poisson distribution generally used to monitor the number of defects in statistical process control. However, if the c-chart is used in a semiconductor manufacturing process, the process will often be declared out-of-control although the process is in-control, because the number of particles on a wafer does not follow a Poisson distribution. In this study, we assume that the particle distribution follows a negative binomial distribution, and propose a procedure for the use of a control chart that includes outlier removal. The usefulness of this proposal is then shown by simulation, numerical analysis, and application of the proposed steps to real data.

Suggested Citation

  • Kawamura Hironobu & Nishina Ken & Higashide Masanobu, 2008. "Control Charts for Particles in the Semiconductor Manufacturing Process," Stochastics and Quality Control, De Gruyter, vol. 23(1), pages 95-107, January.
    • Handle: RePEc:bpj:ecqcon:v:23:y:2008:i:1:p:95-107:n:10
    DOI: 10.1515/EQC.2008.95
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    References listed on IDEAS

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    1. Susan L. Albin & David J. Friedman, 1989. "The Impact of Clustered Defect Distributions in IC Fabrication," Management Science, INFORMS, vol. 35(9), pages 1066-1078, September.
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