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Innovation and Economic Growth in East Asia: An Overview

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  • Albert Guangzhou Hu

Abstract

type="main"> East Asia has been one of the most dynamic regions of economic growth and development. The past two decades have seen tremendous economic and technological catching up in the region. Using South Korea as a case to illustrate the process of technology catching up, we find that the process of graduating from imitation to innovation is a nonlinear one, and requires conscious efforts to invest in research and development and other technological capability-enhancing activities. Successful technology upgrading also calls for policies and institutions that are relevant to technological innovation to evolve and adapt as an economy goes through the different stages of economic and technological development.

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  • Albert Guangzhou Hu, 2015. "Innovation and Economic Growth in East Asia: An Overview," Asian Economic Policy Review, Japan Center for Economic Research, vol. 10(1), pages 19-37, January.
    • Handle: RePEc:bla:asiapr:v:10:y:2015:i:1:p:19-37
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    1. Jong-Wha Lee, 2015. "Comment on “Innovation and Economic Growth in East Asia: An Overview”," Asian Economic Policy Review, Japan Center for Economic Research, vol. 10(1), pages 41-42, January.
    2. Takatoshi Ito & Kazumasa Iwata & Colin McKenzie & Shujiro Urata, 2015. "Innovation in East Asia: Editors' Overview," Asian Economic Policy Review, Japan Center for Economic Research, vol. 10(1), pages 1-18, January.
    3. Candelaria Barrios & Esther Flores & M. Ángeles Martínez & Marta Ruiz-Martínez, 2023. "Are the Major Knowledge-producing Countries Converging in Science and Technology Capabilities?," Journal of the Knowledge Economy, Springer;Portland International Center for Management of Engineering and Technology (PICMET), vol. 14(4), pages 4534-4560, December.
    4. B.G. Jean Jacques Iritié, 2018. "Economic issues of innovation clusters-based industrial policy: a critical overview," Global Business and Economics Review, Inderscience Enterprises Ltd, vol. 20(3), pages 286-307.

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