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From Stacks to Circuits: A Regenerative Socio-Technical Roadmap for AI Infrastructure within Planetary Boundaries

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  • Han-Teng Liao
  • Karen Ang

Abstract

Current scaling trajectories for Generative AI, typified by linear supply-side "stacks," prioritize performance density while externalizing significant thermodynamic and material costs. As the "Twin Transition" of green and digital transformation accelerates, the industry faces technology gaps - including Scope 3 emissions and e-waste recycling - that impede sustainable scaling and lead to social tensions. This study proposes a Regenerative Socio-Technical roadmap that repurposes the Sustainable Production and Consumption system map to reframe artificial intelligence infrastructure as a system-of-systems governed ultimately by planetary limits. By integrating the Institute of Electrical and Electronics Engineers International Roadmap for Devices and Systems (IEEE IRDS) sustainability considerations for semiconductor facilities, the study proposes a metabolic circuit framework that centers "Values and Needs" within production and consumption relationship loops. This study identifies critical gaps in current Nvidia-centric roadmaps and proposes a competing reference architecture. It demonstrates how a spontaneous order of resource parsimony and planetary accountability can provide an actionable pathway for regulatory compliance and industrial resilience in the digital circular economy.

Suggested Citation

  • Han-Teng Liao & Karen Ang, 2026. "From Stacks to Circuits: A Regenerative Socio-Technical Roadmap for AI Infrastructure within Planetary Boundaries," Papers 2606.10544, arXiv.org.
  • Handle: RePEc:arx:papers:2606.10544
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    1. Konstantinos Voulgaridis & Thomas Lagkas & Constantinos Marios Angelopoulos & Alexandros-Apostolos A. Boulogeorgos & Vasileios Argyriou & Panagiotis Sarigiannidis, 2024. "Digital product passports as enablers of digital circular economy: a framework based on technological perspective," Telecommunication Systems: Modelling, Analysis, Design and Management, Springer, vol. 85(4), pages 699-715, April.
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