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Evolutions of Solder Materials for Memory Packaging in Handheld, Automotive and Cryogenic Applications

In: Electronic Materials Innovations and Reliability in Advanced Memory Packaging

Author

Listed:
  • Chong Leong Gan

    (Micron Memory Taiwan Co., Ltd.)

  • Chen Yu Huang

    (Micron Memory Taiwan Co., Ltd.)

Abstract

The purpose of this Chapter is to provide an overview of evolutions of solder materials used in semiconductor assembly and packaging. Also, with the aim to study the key technical barriers, challenges of deployment and its reliability performance of different solder alloy interconnect reliability requirements in semiconductor device packaging by different market segments especially in mobile handheld as well as automotive requirements. This chapter lays out the history and important evolutions of different solder alloys in semiconductor packaging followed by ways to fulfil needs of different market segments.

Suggested Citation

  • Chong Leong Gan & Chen Yu Huang, 2025. "Evolutions of Solder Materials for Memory Packaging in Handheld, Automotive and Cryogenic Applications," Springer Series in Reliability Engineering, in: Electronic Materials Innovations and Reliability in Advanced Memory Packaging, chapter 0, pages 151-173, Springer.
    • Handle: RePEc:spr:ssrchp:978-3-031-94795-7_7
    DOI: 10.1007/978-3-031-94795-7_7
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