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Hardware Reliability for Module and Solid-State Drives (SSDs)

In: Electronic Materials Innovations and Reliability in Advanced Memory Packaging

Author

Listed:
  • Chong Leong Gan

    (Micron Memory Taiwan Co., Ltd.)

  • Chen Yu Huang

    (Micron Memory Taiwan Co., Ltd.)

Abstract

Semiconductor packaging materials have very strong influences in final package quality and reliability. There are many previous studies being carried out in characterizing effects of key direct materials used in memory modules and solid-state drive (SSDSolid State Drive (SSD)) for board level reliability [1–6]. In this chapter, the influencing factors of such as prevailing hardware and components (actives, passives, connectors, enclosure, heatsink), polymeric materials (edge bond, corner fill, underfillUnderfill (UF) materials), thermal interface materialsThermal Interface Material (TIM) (TIMThermal Interface Material (TIM)), technical challenges with hardware engineering and characterization of system level packaging will be discussed.

Suggested Citation

  • Chong Leong Gan & Chen Yu Huang, 2025. "Hardware Reliability for Module and Solid-State Drives (SSDs)," Springer Series in Reliability Engineering, in: Electronic Materials Innovations and Reliability in Advanced Memory Packaging, chapter 0, pages 129-149, Springer.
    • Handle: RePEc:spr:ssrchp:978-3-031-94795-7_6
    DOI: 10.1007/978-3-031-94795-7_6
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