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Substrate and Printed Circuits Board (PCB) for Memory Device Packaging

In: Electronic Materials Innovations and Reliability in Advanced Memory Packaging

Author

Listed:
  • Chong Leong Gan

    (Micron Memory Taiwan Co., Ltd.)

  • Chen Yu Huang

    (Micron Memory Taiwan Co., Ltd.)

Abstract

Semiconductor packaging substrate and printed circuits board (PCBPrinted Circuit Boards (PCB)) materials have very strong influences in final package quality and reliability. There are many previous studies being carried out in characterizing effects of substrate and PCBPrinted Circuit Boards (PCB) material properties and materials used in memory modules and solid state drive (SSDSolid State Drive (SSD)) for board level reliability [1–6]. This chapter will review the influencing factors and technical challenges of prevailing substrates and PCBsPrinted Circuit Boards (PCB), focusing on hardware engineering and system-level packaging characterization.

Suggested Citation

  • Chong Leong Gan & Chen Yu Huang, 2025. "Substrate and Printed Circuits Board (PCB) for Memory Device Packaging," Springer Series in Reliability Engineering, in: Electronic Materials Innovations and Reliability in Advanced Memory Packaging, chapter 0, pages 81-100, Springer.
    • Handle: RePEc:spr:ssrchp:978-3-031-94795-7_4
    DOI: 10.1007/978-3-031-94795-7_4
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