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Epoxy Molding Compounds in Mechanical and Thermal Stress in Packaging Reliability

In: Electronic Materials Innovations and Reliability in Advanced Memory Packaging

Author

Listed:
  • Chong Leong Gan

    (Micron Memory Taiwan Co., Ltd.)

  • Chen Yu Huang

    (Micron Memory Taiwan Co., Ltd.)

Abstract

In the past fewEpoxy Molding Compound (EMC) years, advanced silicon node and packaging technology are significantly driven by the growing market on artificial intelligence (AIArtificial Intelligence (AI)), ChatGPT, 5G applications, high performance computing (HPCHigh Performance Computing (HPC)), internet of thing (IoTInternet of Thing (IoT)) and electronics in autonomous vehicle. Continuous higher demand for low power, larger data storage and faster transport speed are pushing the memory key suppliers to provide the advanced packages solutions such as uMCPUniversal Flash Storage Based Multi-Chip Package (uMCP) (Universal Flash Storage Based Multi-Chip Package), NAND-Based MCPMulti-Chip Packaging (MCP) (Multiple Chip Package) and HBMHigh Bandwidth Memory (HBM) (High Bandwidth MemoryHigh Bandwidth Memory (HBM)) for high-end applications.

Suggested Citation

  • Chong Leong Gan & Chen Yu Huang, 2025. "Epoxy Molding Compounds in Mechanical and Thermal Stress in Packaging Reliability," Springer Series in Reliability Engineering, in: Electronic Materials Innovations and Reliability in Advanced Memory Packaging, chapter 0, pages 25-44, Springer.
    • Handle: RePEc:spr:ssrchp:978-3-031-94795-7_2
    DOI: 10.1007/978-3-031-94795-7_2
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