IDEAS home Printed from https://ideas.repec.org/h/spr/ssrchp/978-3-031-94795-7_1.html
   My bibliography  Save this book chapter

Influences of Electronic Materials Properties on Packaging Reliability

In: Electronic Materials Innovations and Reliability in Advanced Memory Packaging

Author

Listed:
  • Chong Leong Gan

    (Micron Memory Taiwan Co., Ltd.)

  • Chen Yu Huang

    (Micron Memory Taiwan Co., Ltd.)

Abstract

Semiconductor packaging materials have very strong influences in final package quality and reliability. There are many previous studies being carried out in characterizing effects of key materials properties of epoxy molding compound (EMCEpoxy Molding Compound (EMC)), solder alloys, die attach film (DAFDie Attach Film (DAF)), bonding wires, capillary underfillCapillary Underfill (CUF) materials and solder pastes [1]. In this chapter, the influencing factors of such as prevailing interconnect materials (bonding wires, solder alloys, solder paste), polymeric materials (epoxy molding compoundEpoxy Molding Compound (EMC), die attach filmDie Attach Film (DAF) and underfillUnderfill (UF) materials), advanced specialty low temperature soldersLow Temperature Solder (LTS), technical challenges with stacked die packaging and characterization of electronic packaging materials will be discussed.

Suggested Citation

  • Chong Leong Gan & Chen Yu Huang, 2025. "Influences of Electronic Materials Properties on Packaging Reliability," Springer Series in Reliability Engineering, in: Electronic Materials Innovations and Reliability in Advanced Memory Packaging, chapter 0, pages 1-24, Springer.
    • Handle: RePEc:spr:ssrchp:978-3-031-94795-7_1
    DOI: 10.1007/978-3-031-94795-7_1
    as

    Download full text from publisher

    To our knowledge, this item is not available for download. To find whether it is available, there are three options:
    1. Check below whether another version of this item is available online.
    2. Check on the provider's web page whether it is in fact available.
    3. Perform a
    for a similarly titled item that would be available.

    More about this item

    Statistics

    Access and download statistics

    Corrections

    All material on this site has been provided by the respective publishers and authors. You can help correct errors and omissions. When requesting a correction, please mention this item's handle: RePEc:spr:ssrchp:978-3-031-94795-7_1. See general information about how to correct material in RePEc.

    If you have authored this item and are not yet registered with RePEc, we encourage you to do it here. This allows to link your profile to this item. It also allows you to accept potential citations to this item that we are uncertain about.

    We have no bibliographic references for this item. You can help adding them by using this form .

    If you know of missing items citing this one, you can help us creating those links by adding the relevant references in the same way as above, for each refering item. If you are a registered author of this item, you may also want to check the "citations" tab in your RePEc Author Service profile, as there may be some citations waiting for confirmation.

    For technical questions regarding this item, or to correct its authors, title, abstract, bibliographic or download information, contact: Sonal Shukla or Springer Nature Abstracting and Indexing (email available below). General contact details of provider: http://www.springer.com .

    Please note that corrections may take a couple of weeks to filter through the various RePEc services.

    IDEAS is a RePEc service. RePEc uses bibliographic data supplied by the respective publishers.