IDEAS home Printed from https://ideas.repec.org/h/spr/ssrchp/978-3-031-26708-6_3.html
   My bibliography  Save this book chapter

Recycling of Noble Metals Used in Memory Packaging

In: Interconnect Reliability in Advanced Memory Device Packaging

Author

Listed:
  • Chong Leong, Gan

    (Micron Memory Taiwan Co. Ltd.)

  • Chen-Yu, Huang

    (Micron Memory Taiwan Co. Ltd.)

Abstract

This Chapter provides an overview of current and future deployment of recycling some noble metals on interconnect metals used in semiconductor assembly and packaging. Also, with the aim to study the key technical barriers, challenges of deployment and its reliability performance of both recycled gold (Au) and recycled copper (Cu) in semiconductor device packaging. This paper lays out the importance of ensuring noble metals in terms of its materials sustainability for the next decade. This article briefly reviews key aspects of deployment of recycled Au wire, recycled Cu, and other noble metals in semiconductor packaging and assembly. List of key technical challenges have been covered in this paper. The research trends on Sustainable Development Goal (SDG) technological and materials aspects highlight the critical role of recycling noble metals technology in semiconductor industry. At the end of this chapter, summary and key recommendation of future works have been provided for better clarity and reference purposes.

Suggested Citation

  • Chong Leong, Gan & Chen-Yu, Huang, 2023. "Recycling of Noble Metals Used in Memory Packaging," Springer Series in Reliability Engineering, in: Interconnect Reliability in Advanced Memory Device Packaging, chapter 0, pages 45-66, Springer.
    • Handle: RePEc:spr:ssrchp:978-3-031-26708-6_3
    DOI: 10.1007/978-3-031-26708-6_3
    as

    Download full text from publisher

    To our knowledge, this item is not available for download. To find whether it is available, there are three options:
    1. Check below whether another version of this item is available online.
    2. Check on the provider's web page whether it is in fact available.
    3. Perform a search for a similarly titled item that would be available.

    More about this item

    Statistics

    Access and download statistics

    Corrections

    All material on this site has been provided by the respective publishers and authors. You can help correct errors and omissions. When requesting a correction, please mention this item's handle: RePEc:spr:ssrchp:978-3-031-26708-6_3. See general information about how to correct material in RePEc.

    If you have authored this item and are not yet registered with RePEc, we encourage you to do it here. This allows to link your profile to this item. It also allows you to accept potential citations to this item that we are uncertain about.

    We have no bibliographic references for this item. You can help adding them by using this form .

    If you know of missing items citing this one, you can help us creating those links by adding the relevant references in the same way as above, for each refering item. If you are a registered author of this item, you may also want to check the "citations" tab in your RePEc Author Service profile, as there may be some citations waiting for confirmation.

    For technical questions regarding this item, or to correct its authors, title, abstract, bibliographic or download information, contact: Sonal Shukla or Springer Nature Abstracting and Indexing (email available below). General contact details of provider: http://www.springer.com .

    Please note that corrections may take a couple of weeks to filter through the various RePEc services.

    IDEAS is a RePEc service. RePEc uses bibliographic data supplied by the respective publishers.