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Advanced Memory and Device Packaging

In: Interconnect Reliability in Advanced Memory Device Packaging

Author

Listed:
  • Chong Leong, Gan

    (Micron Memory Taiwan Co. Ltd.)

  • Chen-Yu, Huang

    (Micron Memory Taiwan Co. Ltd.)

Abstract

Assembly and reliability of memory device packaging are very important topics in semiconductor manufacturing. There are many books and papers written on them. In this chapter, the assembly of memory devices such as prevailing interconnect materials (bonding wires, solder alloys, solder paste), polymeric materials (epoxy molding compound, die attach film and underfill materials), advanced specialty low temperature solders, technical challenges with stacked die packaging and characterization of electronic packaging materials will be discussed. The reliability of lead-free solder joints such as reliability testing and data analyses, design for reliability, and failure analyses of lead-free solder joints will be discussed, in this chapter. Evolution of these key assembly materials will be discussed in terms of its technical challenges and enabling reasoning as well as possible failure modes and mechanisms to address the needs and callouts for identifying those key materials characteristics which are critical to memory stacked die packaging. At the end of this chapter, summary and key recommendation of future works have been provided for better clarity and reference purposes.

Suggested Citation

  • Chong Leong, Gan & Chen-Yu, Huang, 2023. "Advanced Memory and Device Packaging," Springer Series in Reliability Engineering, in: Interconnect Reliability in Advanced Memory Device Packaging, chapter 0, pages 1-19, Springer.
    • Handle: RePEc:spr:ssrchp:978-3-031-26708-6_1
    DOI: 10.1007/978-3-031-26708-6_1
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