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Fatigue Life Model for PLCC Solder Joints Under Thermal Cycling Stress

In: Advances in RAMS Engineering

Author

Listed:
  • Rohit Khatri

    (Homi Bhabha National Institute)

  • Diana Denice

    (Bhabha Atomic Research Centre)

  • Manoj Kumar

    (Bhabha Atomic Research Centre)

Abstract

Solder joints are inevitable part of assembly of an electronic system. These joints are mainly for establishing electrical connection between components, in addition these are also responsible for mechanical bonding and act as heat paths. Life cycle stresses affect the integrity of these contacts and lead to jeopardizing of its functions and in turn to failure of system. The reducing size and changing geometry of solder joints coupled with high power density of the components has increased the contribution of solder joint failure in total system failure. Cycle stresses lead to fatigue failure of solder joints. Thermal cycling is reported to be the major cause of failures. Life estimation of solder joints is important to predict the time to failure and take counter measures. The chapter addresses this issue by specializing an established empirical model for fatigue failure, Coffin-Manson, for a PLCC solder joint using experimental data.

Suggested Citation

  • Rohit Khatri & Diana Denice & Manoj Kumar, 2020. "Fatigue Life Model for PLCC Solder Joints Under Thermal Cycling Stress," Springer Series in Reliability Engineering, in: Durga Rao Karanki & Gopika Vinod & Srividya Ajit (ed.), Advances in RAMS Engineering, pages 85-107, Springer.
    • Handle: RePEc:spr:ssrchp:978-3-030-36518-9_4
    DOI: 10.1007/978-3-030-36518-9_4
    as

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