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Finite Element Method for Electromigration Study

In: Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections

Author

Listed:
  • Cher Ming Tan

    (Nanyang Technological University)

  • Zhenghao Gan

    (Semiconductor Manufacturing International (Shanghai) Corp.)

  • Wei Li

    (Singapore Institute of Manufacturing Technology)

  • Yuejin Hou

    (Nanyang Technological University)

Abstract

In Chap. 3, we introduce the basic concept and the general theory of finite element method (FEM) for electrical, thermal, mechanical, and coupled-field multi-physics analysis. EM is a complicated physical and material phenomenon that involves the analysis of electro-thermo-mechanical-coupled field analysis and governed by various partial differential equations. FEM is able to solve the partial differential equation and handle complex geometries (and boundaries) with relative ease. Therefore, several EM studies employ the FEM for more complete investigation on different interconnect structures. In this chapter, we will provide an overview on the application of FEM for EM study.

Suggested Citation

  • Cher Ming Tan & Zhenghao Gan & Wei Li & Yuejin Hou, 2011. "Finite Element Method for Electromigration Study," Springer Series in Reliability Engineering, in: Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections, edition 1, chapter 0, pages 73-112, Springer.
    • Handle: RePEc:spr:ssrchp:978-0-85729-310-7_4
    DOI: 10.1007/978-0-85729-310-7_4
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