IDEAS home Printed from https://ideas.repec.org/h/spr/sprchp/978-3-031-91312-9_10.html

Novel Non-thermal Ablation Mechanics in the Laser Ablation of Silicon

In: High Performance Computing in Science and Engineering '23

Author

Listed:
  • Dominic Klein

    (Universität Stuttgart, Institut für Funktionelle Materie und Quantentechnologien)

  • Simon Kümmel

    (Universität Stuttgart, Institut für Funktionelle Materie und Quantentechnologien)

  • Johannes Roth

    (Universität Stuttgart, Institut für Funktionelle Materie und Quantentechnologien)

Abstract

We investigate the non-thermal material dynamics of strongly excited silicon during ultra-fast laser ablation. In contrast to metals, silicon shows strongly excitation-dependent interatomic bonding strengths, which gives rise to a number of unique material dynamics like non-thermal melting, Coulomb explosions and altered carrier heat conduction due to charge carrier confinement. In this study, we report novel non-thermal ablation mechanisms in the ultra-fast single shot laser ablation of silicon and perform large scale massive multi-parallel simulations on experimentally achievable length scales with atomistic resolution. For this, we model the ultra-fast carrier dynamic utilizing the Thermal-Spike-Model coupled to Molecular Dynamics simulations and include the accompanied excitation-dependent non-thermal bonding strength manipulation by application of the excitation-dependent modified Tersoff Potential. Further, we present first results on the systematic construction of the excitation-dependent phase diagram of silicon by thermodynamic integration.

Suggested Citation

  • Dominic Klein & Simon Kümmel & Johannes Roth, 2026. "Novel Non-thermal Ablation Mechanics in the Laser Ablation of Silicon," Springer Books, in: Thomas Ludwig & Peter Bastian & Michael M. Resch (ed.), High Performance Computing in Science and Engineering '23, pages 133-147, Springer.
    • Handle: RePEc:spr:sprchp:978-3-031-91312-9_10
    DOI: 10.1007/978-3-031-91312-9_10
    as

    Download full text from publisher

    To our knowledge, this item is not available for download. To find whether it is available, there are three options:
    1. Check below whether another version of this item is available online.
    2. Check on the provider's web page whether it is in fact available.
    3. Perform a
    for a similarly titled item that would be available.

    More about this item

    Statistics

    Access and download statistics

    Corrections

    All material on this site has been provided by the respective publishers and authors. You can help correct errors and omissions. When requesting a correction, please mention this item's handle: RePEc:spr:sprchp:978-3-031-91312-9_10. See general information about how to correct material in RePEc.

    If you have authored this item and are not yet registered with RePEc, we encourage you to do it here. This allows to link your profile to this item. It also allows you to accept potential citations to this item that we are uncertain about.

    We have no bibliographic references for this item. You can help adding them by using this form .

    If you know of missing items citing this one, you can help us creating those links by adding the relevant references in the same way as above, for each refering item. If you are a registered author of this item, you may also want to check the "citations" tab in your RePEc Author Service profile, as there may be some citations waiting for confirmation.

    For technical questions regarding this item, or to correct its authors, title, abstract, bibliographic or download information, contact: Sonal Shukla or Springer Nature Abstracting and Indexing (email available below). General contact details of provider: http://www.springer.com .

    Please note that corrections may take a couple of weeks to filter through the various RePEc services.

    IDEAS is a RePEc service. RePEc uses bibliographic data supplied by the respective publishers.