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High-performance multiphase-field simulations of solid-state phase transformations using Pace3D

In: High Performance Computing in Science and Engineering '21

Author

Listed:
  • E. Schoof

    (Institute of Applied Materials (IAM), Karlsruhe Institute of Technology (KIT))

  • T. Mittnacht

    (Institute of Applied Materials (IAM), Karlsruhe Institute of Technology (KIT))

  • M. Seiz

    (Institute of Applied Materials (IAM), Karlsruhe Institute of Technology (KIT))

  • P. Hoffrogge

    (Institute of Applied Materials (IAM), Karlsruhe Institute of Technology (KIT))

  • H. Hierl

    (Institute of Applied Materials (IAM), Karlsruhe Institute of Technology (KIT))

  • B. Nestler

    (Institute of Applied Materials (IAM), Karlsruhe Institute of Technology (KIT)
    Institute of Digital Materials, Hochschule Karlsruhe Technik und Wirtschaft)

Abstract

Computational materials science contributes to the accelerated development of new or optimized materials. The phase-field method has established itself as a powerful tool to describe the temporal microstructure evolution during solidphase transformations. The use of high performance computers allows studying the evolution of large, three-dimensional microstructures incorporating phase- and grain boundary specific behaviors as well as phase transitions. This allows a more realistic representation of the phenomena investigated and lead to more reliable predictions of the microstructural evolution. In this work, current applications of the phase-field method are presented using the Pace3D software package and applied at the ForHLR II supercomputer. Additionally, the scaling behavior is shown when using up to 5041 cores.

Suggested Citation

  • E. Schoof & T. Mittnacht & M. Seiz & P. Hoffrogge & H. Hierl & B. Nestler, 2023. "High-performance multiphase-field simulations of solid-state phase transformations using Pace3D," Springer Books, in: Wolfgang E. Nagel & Dietmar H. Kröner & Michael M. Resch (ed.), High Performance Computing in Science and Engineering '21, pages 167-184, Springer.
    • Handle: RePEc:spr:sprchp:978-3-031-17937-2_10
    DOI: 10.1007/978-3-031-17937-2_10
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