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Modeling and Optimization of U-shaped Sequence-dependent Disassembly Line Balancing Problem

In: Proceedings of the 2025 3rd International Conference on Digital Economy and Management Science (CDEMS 2025)

Author

Listed:
  • Jia Liu

    (Qingdao University of Technology, Business School)

  • Lujing Wang

    (Qingdao University of Technology, Business School)

  • Shuwei Wang

    (Shandong University of Science and Technology, College of Economics & Management)

Abstract

Disassembly line is the most suitable way for enterprises to disassemble large-scale waste products. However, the disassembly process is complex. It is hard to balance the workload among workstations of line, so designing and balancing the disassembly line is important. Besides, in disassembly process some precedence free parts may interfere with each other. Whenever precedence free tasks interact, their task times will be influenced based on the order in which they are performed. Therefore, in this paper, a multi-objective mathematical model is constructed for U-shaped Sequence-dependent Disassembly Line Balancing Problem (USDDLBP). From efficiency, economic and environmental concerns, the number of open workstations, the smoothing index, and the early disassembly of hazardous and high-demand parts are considered in the disassembly process. The artificial bee colony algorithm is used to solve the problem. The performance of U-shaped and linear disassembly lines is evaluated by benchmark examples, and the calculation results prove the rationality and effectiveness of the presented model for the USDDLBP.

Suggested Citation

  • Jia Liu & Lujing Wang & Shuwei Wang, 2025. "Modeling and Optimization of U-shaped Sequence-dependent Disassembly Line Balancing Problem," Advances in Economics, Business and Management Research, in: Wenke Zang & Chunping Xia (ed.), Proceedings of the 2025 3rd International Conference on Digital Economy and Management Science (CDEMS 2025), pages 760-766, Springer.
  • Handle: RePEc:spr:advbcp:978-94-6463-770-0_86
    DOI: 10.2991/978-94-6463-770-0_86
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