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High-technology Industry Agglomeration, Spatial Spillover Effects and Regional Economic Resilience Enhancement

In: Proceedings of the 2025 10th International Conference on Social Sciences and Economic Development (ICSSED 2025)

Author

Listed:
  • Fang Wang

    (Wuhan University of Technology, School of Economics
    Hubei Science and Technology Innovation and Economic Development Research Centre)

  • Yue Cao

    (Wuhan University of Technology, School of Economics)

  • Wei Hu

    (Wuhan University of Technology, School of Economics)

Abstract

This paper explores the impact of high-tech industrial agglomeration on regional economic resilience by constructing a two-way fixed-effects model based on the sample data of 31 provinces and cities in China from 2000 to 2021. The results show that the local economic resilience is strengthened with the increase of the level of industrial agglomeration. The results show that local economic resilience increases with the level of industrial agglomeration, and the findings remain reliable after a series of robustness tests. The heterogeneity test finds that the enhancement of regional economic resilience by high-tech industrial agglomeration is more obvious in the central region and at high marketisation levels. In order to further explore the spatial effect of high-tech industrial agglomeration on regional economic resilience, this paper chooses the spatial Durbin model for empirical research, and the regression results show that high-tech industrial agglomeration in this region will have a significant impact on the economic resilience of the neighbouring provinces.

Suggested Citation

  • Fang Wang & Yue Cao & Wei Hu, 2025. "High-technology Industry Agglomeration, Spatial Spillover Effects and Regional Economic Resilience Enhancement," Advances in Economics, Business and Management Research, in: Huaping Sun & Hang Luo & Vilas Gaikar & Natālija Cudečka-Puriņa (ed.), Proceedings of the 2025 10th International Conference on Social Sciences and Economic Development (ICSSED 2025), pages 578-591, Springer.
  • Handle: RePEc:spr:advbcp:978-94-6463-734-2_64
    DOI: 10.2991/978-94-6463-734-2_64
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