IDEAS home Printed from https://ideas.repec.org/a/wsi/srlxxx/v32y2025i09ns0218625x24501257.html
   My bibliography  Save this article

INFLUENCE OF SUBSTRATE TEMPERATURE ON THE MICROSTRUCTURE AND PROPERTIES OF CoCrFeNiNbx HIGH ENTROPY ALLOY COATINGS

Author

Listed:
  • XUEHUI HAO

    (School of Materials Science and Engineering, Liaocheng University, 252059 Liaocheng, P. R. China)

  • JINGRU CHEN

    (School of Materials Science and Engineering, Liaocheng University, 252059 Liaocheng, P. R. China)

  • XUEFENG ZOU

    (School of Materials Science and Engineering, Liaocheng University, 252059 Liaocheng, P. R. China)

  • YAQI GUO

    (School of Materials Science and Engineering, Liaocheng University, 252059 Liaocheng, P. R. China)

  • ZHIHAO LI

    (School of Materials Science and Engineering, Liaocheng University, 252059 Liaocheng, P. R. China)

  • CHANGZHENG WANG

    (School of Materials Science and Engineering, Liaocheng University, 252059 Liaocheng, P. R. China)

Abstract

This work studies the effect of the substrate temperature on the microstructure and properties of CoCrFeNiNbx high entropy alloy (HEA) coatings fabricated by magnetron sputtering. The results indicate that all three CoCrFeNiNbx HEA coatings were composed of a simple FCC solid solution with a columnar structure. As the substrate temperature increased, Nb content in the FCC matrix increased while the grain size first decreased and then increased. Accordingly, CoCrFeNiNbx HEA coatings exhibited an increasing micro-hardness and a decreasing fracture toughness with the increasing substrate temperature. Moreover, CoCrFeNiNbx HEA coating deposited at 200∘ had better corrosion performance, which was due to its better surface quality and denser columnar structure compared to the other two coatings.

Suggested Citation

  • Xuehui Hao & Jingru Chen & Xuefeng Zou & Yaqi Guo & Zhihao Li & Changzheng Wang, 2025. "INFLUENCE OF SUBSTRATE TEMPERATURE ON THE MICROSTRUCTURE AND PROPERTIES OF CoCrFeNiNbx HIGH ENTROPY ALLOY COATINGS," Surface Review and Letters (SRL), World Scientific Publishing Co. Pte. Ltd., vol. 32(09), pages 1-10, September.
    • Handle: RePEc:wsi:srlxxx:v:32:y:2025:i:09:n:s0218625x24501257
    DOI: 10.1142/S0218625X24501257
    as

    Download full text from publisher

    File URL: http://www.worldscientific.com/doi/abs/10.1142/S0218625X24501257
    Download Restriction: Access to full text is restricted to subscribers
    File URL: https://libkey.io/10.1142/S0218625X24501257?utm_source=ideas
    LibKey link: if access is restricted and if your library uses this service, LibKey will redirect you to where you can use your library subscription to access this item
    ---><---

    As the access to this document is restricted, you may want to

    for a different version of it.

    More about this item

    Keywords

    ;
    ;
    ;
    ;

    Statistics

    Access and download statistics

    Corrections

    All material on this site has been provided by the respective publishers and authors. You can help correct errors and omissions. When requesting a correction, please mention this item's handle: RePEc:wsi:srlxxx:v:32:y:2025:i:09:n:s0218625x24501257. See general information about how to correct material in RePEc.

    If you have authored this item and are not yet registered with RePEc, we encourage you to do it here. This allows to link your profile to this item. It also allows you to accept potential citations to this item that we are uncertain about.

    We have no bibliographic references for this item. You can help adding them by using this form .

    If you know of missing items citing this one, you can help us creating those links by adding the relevant references in the same way as above, for each refering item. If you are a registered author of this item, you may also want to check the "citations" tab in your RePEc Author Service profile, as there may be some citations waiting for confirmation.

    For technical questions regarding this item, or to correct its authors, title, abstract, bibliographic or download information, contact: Tai Tone Lim (email available below). General contact details of provider: http://www.worldscinet.com/srl/srl.shtml .

    Please note that corrections may take a couple of weeks to filter through the various RePEc services.

    IDEAS is a RePEc service. RePEc uses bibliographic data supplied by the respective publishers.