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Electrochemical Migration Failure Of Pure Tin Under Bromide-Polluted Thin Electrolyte Layer

Author

Listed:
  • QIAO ZENG

    (School of Chemistry and Chemical Engineering, Guangzhou University, Guangzhou, Guangdong 510006, P. R. China)

  • HUIKAN CHEN

    (School of Chemistry and Chemical Engineering, Guangzhou University, Guangzhou, Guangdong 510006, P. R. China)

  • BOKAI LIAO

    (School of Chemistry and Chemical Engineering, Guangzhou University, Guangzhou, Guangdong 510006, P. R. China†Joint Institute of Guangzhou University and Institute of Corrosion Science and Technology, Guangzhou University, Guangzhou, Guangdong 510006, P. R. China)

  • XINGPENG GUO

    (School of Chemistry and Chemical Engineering, Guangzhou University, Guangzhou, Guangdong 510006, P. R. China†Joint Institute of Guangzhou University and Institute of Corrosion Science and Technology, Guangzhou University, Guangzhou, Guangdong 510006, P. R. China‡School of Chemistry and Chemical Engineering, Huazhong University of Science and Technology, Wuhan, Hubei 430074, P. R. China)

Abstract

The electrochemical migration (ECM) time to failure (TTF) tests for pure tin in the bromide-containing environment were carried out using the thin electrolyte layer (TEL) method. In-situ electrochemical measurement was made to monitor the ECM behavior while the changes of surface morphology and localized pH during the ECM process were real-time observed using the 3D optical digital microscope. Microstructure and composition of products obtained after the ECM tests were characterized using the scanning electron microscope, energy-dispersive spectrometer and X-ray diffractometer. Results indicated that the growth rate of dendrite increased with bromide ion concentration at low bromide concentration levels, and it decreased at medium concentration levels. Tree-like tin dendrites covered with white precipitates are formed after the ECM tests. As for the high bromide ion concentration condition, no dendrite can be found and a thick layer of precipitate is formed between the twin electrodes. This precipitate layer has a higher thickness than the electrolyte layer, which can act as a barrier layer retarding ionic migration and thus inhibiting the ECM failure. Relevant mechanism has been proposed to clarify the effect of bromide ions on the ECM of pure tin under the thin electrolyte layer.

Suggested Citation

  • Qiao Zeng & Huikan Chen & Bokai Liao & Xingpeng Guo, 2022. "Electrochemical Migration Failure Of Pure Tin Under Bromide-Polluted Thin Electrolyte Layer," Surface Review and Letters (SRL), World Scientific Publishing Co. Pte. Ltd., vol. 29(07), pages 1-8, July.
    • Handle: RePEc:wsi:srlxxx:v:29:y:2022:i:07:n:s0218625x22500895
    DOI: 10.1142/S0218625X22500895
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