IDEAS home Printed from https://ideas.repec.org/a/wsi/srlxxx/v26y2019i06ns0218625x18502086.html
   My bibliography  Save this article

ELECTROCHEMICAL MIGRATION BEHAVIOR OF Sn-3.0Ag-0.5Cu SOLDER ALLOY UNDER THIN ELECTROLYTE LAYERS

Author

Listed:
  • BOKAI LIAO

    (Hubei Key Laboratory of Materials Chemistry and Service Failure, School of Chemistry and Chemical Engineering, Huazhong University of Science and Technology, Wuhan 430074, P. R. China)

  • WENFENG JIA

    (#x2020;Sinopec Research Institute of Petroleum Engineering, Beijing 100101, P. R. China)

  • RUIYAN SUN

    (#x2021;Survey and Design Institute, Jilin Oilfield, Songyuan 138001, P. R. China)

  • ZHENYU CHEN

    (Hubei Key Laboratory of Materials Chemistry and Service Failure, School of Chemistry and Chemical Engineering, Huazhong University of Science and Technology, Wuhan 430074, P. R. China)

  • XINGPENG GUO

    (Hubei Key Laboratory of Materials Chemistry and Service Failure, School of Chemistry and Chemical Engineering, Huazhong University of Science and Technology, Wuhan 430074, P. R. China)

Abstract

The electrochemical migration (ECM) behavior of Sn-3.0Ag-0.5Cu solder alloy under thin electrolyte layers was investigated using a technique based on the coupling of in situ electrochemical measurements and optical observation. Results showed that the mean time to failure first increased and then decreased as thickness of the electrolyte layer increased, the maximum value was present at 200μm. The higher the bias voltage applied, the faster was the rate of dendrite growth. And, Sn leaded the ECM of SAC305 solder alloy. Mechanisms relevant have been proposed to explain the ECM behavior of Sn-3.0Ag-0.5Cu solder alloy.

Suggested Citation

  • Bokai Liao & Wenfeng Jia & Ruiyan Sun & Zhenyu Chen & Xingpeng Guo, 2019. "ELECTROCHEMICAL MIGRATION BEHAVIOR OF Sn-3.0Ag-0.5Cu SOLDER ALLOY UNDER THIN ELECTROLYTE LAYERS," Surface Review and Letters (SRL), World Scientific Publishing Co. Pte. Ltd., vol. 26(06), pages 1-7, July.
    • Handle: RePEc:wsi:srlxxx:v:26:y:2019:i:06:n:s0218625x18502086
    DOI: 10.1142/S0218625X18502086
    as

    Download full text from publisher

    File URL: http://www.worldscientific.com/doi/abs/10.1142/S0218625X18502086
    Download Restriction: Access to full text is restricted to subscribers
    File URL: https://libkey.io/10.1142/S0218625X18502086?utm_source=ideas
    LibKey link: if access is restricted and if your library uses this service, LibKey will redirect you to where you can use your library subscription to access this item
    ---><---

    As the access to this document is restricted, you may want to search for a different version of it.

    Citations

    Citations are extracted by the CitEc Project, subscribe to its RSS feed for this item.
    as


    Cited by:

    1. Maria Abu Bakar & A. Atiqah & Azman Jalar, 2022. "Review on Corrosion in Electronic Packaging Trends of Collaborative between Academia–Industry," Sustainability, MDPI, vol. 14(23), pages 1-33, November.

    Corrections

    All material on this site has been provided by the respective publishers and authors. You can help correct errors and omissions. When requesting a correction, please mention this item's handle: RePEc:wsi:srlxxx:v:26:y:2019:i:06:n:s0218625x18502086. See general information about how to correct material in RePEc.

    If you have authored this item and are not yet registered with RePEc, we encourage you to do it here. This allows to link your profile to this item. It also allows you to accept potential citations to this item that we are uncertain about.

    We have no bibliographic references for this item. You can help adding them by using this form .

    If you know of missing items citing this one, you can help us creating those links by adding the relevant references in the same way as above, for each refering item. If you are a registered author of this item, you may also want to check the "citations" tab in your RePEc Author Service profile, as there may be some citations waiting for confirmation.

    For technical questions regarding this item, or to correct its authors, title, abstract, bibliographic or download information, contact: Tai Tone Lim (email available below). General contact details of provider: http://www.worldscinet.com/srl/srl.shtml .

    Please note that corrections may take a couple of weeks to filter through the various RePEc services.

    IDEAS is a RePEc service. RePEc uses bibliographic data supplied by the respective publishers.