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The Effect Of Copper Ion On The Film Formation Rate Of Titanium-Based Nanoceramic Layer On A Mild Steel Surface

Author

Listed:
  • ALIREZA GHANBARI

    (Department of Materials Science and Manufacturing Technology, Malek Ashtar University of Technology, P. O. Box 15875-1774, Tehran, Iran)

  • MOHAMMAD REZA POURHOSSAINI

    (Department of Materials Science and Manufacturing Technology, Malek Ashtar University of Technology, P. O. Box 15875-1774, Tehran, Iran)

Abstract

In this study, the effect of copper ion (Cu2+) was investigated on the film formation rate of Ti-based nanoceramic conversion layer on a ST12 type mild steel. At the first step, the film formation properties of the Ti conversion layer were characterized using DC polarization technique and FE-SEM micrographs. In the next step, concentration of Cu ion was optimized in the Ti solution bath, and finally, the rate of Ti ion (Ti4+) consumption in the conversion solution bath, with and without Cu ion, was detected by spectrophotometric technique using a dye-metal indicator. It was revealed that the addition of Cu ion to the Ti solution bath could increase the precipitation rate of Ti-based compounds on the mild steel substrate, leading to increment of film formation rate of the conversion layer.

Suggested Citation

  • Alireza Ghanbari & Mohammad Reza Pourhossaini, 2019. "The Effect Of Copper Ion On The Film Formation Rate Of Titanium-Based Nanoceramic Layer On A Mild Steel Surface," Surface Review and Letters (SRL), World Scientific Publishing Co. Pte. Ltd., vol. 26(03), pages 1-7, April.
    • Handle: RePEc:wsi:srlxxx:v:26:y:2019:i:03:n:s0218625x18501652
    DOI: 10.1142/S0218625X18501652
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