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CHARACTERIZATION OF TiCN COATING SYNTHESIZED BY THE PLASMA ENHANCED PHYSICAL VAPOUR DEPOSITION PROCESS ON A CEMENTED CARBIDE TOOL

Author

Listed:
  • T. SAMPATH KUMAR

    (School of Mechanical Engineering, Vellore Institute of Technology, VIT University, Vellore, India)

  • A. VINOTH JEBARAJ

    (School of Mechanical Engineering, Vellore Institute of Technology, VIT University, Vellore, India)

  • K. SIVAKUMAR

    (#x2020;Department of Mechanical Engineering, Valliammai Engineering College, Chennai, India)

  • E. SHANKAR

    (#x2021;Department of Mechanical Engineering, Rajalakshmi Engineering College, Chennai, India)

  • N. TAMILOLI

    (#xA7;Department of Mechanical Engineering, K.L University, Andhra Pradesh, India)

Abstract

In the present investigation, Titanium Carbonitride (TiCN) coating was deposited on a cemented carbide substrate, by means of Plasma Enhanced Physical Vapour Deposition (PEPVD) process. The microstructure of the deposited film was characterized using the Scanning Electron Microscope (SEM). Highly dense, less porous and uniformly distributed TiCN coating was observed on the coated surface. X-Ray diffraction analysis was carried out to access the phases present in the coated layer. The scratch resistance and hardness were measured using the scratch tester and Nanoindenter, respectively. The TiCN coating gives higher hardness and superior scratch resistance when compared to the substrate. The surface morphology of the coated film was characterized using the Atomic Force Microscope (AFM) and was found that the surface roughness was lesser for TiCN coating when compared to cemented carbide substrate. The intensified TiCN coating on the substrate will be useful in improving the surface behavior of cemented carbide cutting tool.

Suggested Citation

  • T. Sampath Kumar & A. Vinoth Jebaraj & K. Sivakumar & E. Shankar & N. Tamiloli, 2018. "CHARACTERIZATION OF TiCN COATING SYNTHESIZED BY THE PLASMA ENHANCED PHYSICAL VAPOUR DEPOSITION PROCESS ON A CEMENTED CARBIDE TOOL," Surface Review and Letters (SRL), World Scientific Publishing Co. Pte. Ltd., vol. 25(08), pages 1-11, December.
    • Handle: RePEc:wsi:srlxxx:v:25:y:2018:i:08:n:s0218625x19500288
    DOI: 10.1142/S0218625X19500288
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