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ION BEAM (Cu–Pb–Sn) IMPLANTATION OF SURFACE LAYER OF 30ChGSN2A

Author

Listed:
  • YU. M. BOROVIN

    (Department of Materials Science, Federal State Budgetary Educational Institution of Higher Education, Moscow Polytechnic University, Moscow 115280, Russian Federation)

  • E. V. LUKYANENKO

    (Department of Materials Science, Federal State Budgetary Educational Institution of Higher Education, Moscow Polytechnic University, Moscow 115280, Russian Federation)

  • V. V. OVCHINNIKOV

    (Department of Materials Science, Federal State Budgetary Educational Institution of Higher Education, Moscow Polytechnic University, Moscow 115280, Russian Federation)

  • T. YU. SKAKOVA

    (Department of Materials Science, Federal State Budgetary Educational Institution of Higher Education, Moscow Polytechnic University, Moscow 115280, Russian Federation)

  • N. V. UCHEVATKINA

    (Department of Materials Science, Federal State Budgetary Educational Institution of Higher Education, Moscow Polytechnic University, Moscow 115280, Russian Federation)

  • S. V. YAKUTINA

    (Department of Materials Science, Federal State Budgetary Educational Institution of Higher Education, Moscow Polytechnic University, Moscow 115280, Russian Federation)

Abstract

Electron microscopy studies were conducted for the fine structure of ion-doped layer on 30ChGSN2A steel obtained by ion implantation of monotectic tin-doped copper–lead alloy Cu64Pb36+Sn. Formation of a multi-level hierarchical structure was detected. The features of formation of each layer were analyzed, and it was found that the main mechanism of formation of these structures is diffusion and relaxation resulting in the occurrence of internal stresses both in the surface layer and in the sheet of 30ChGSN2A steel. Relaxation of elastic stress fields results in translational–rotational deformation forming various vortex structures.

Suggested Citation

  • Yu. M. Borovin & E. V. Lukyanenko & V. V. Ovchinnikov & T. Yu. Skakova & N. V. Uchevatkina & S. V. Yakutina, 2018. "ION BEAM (Cu–Pb–Sn) IMPLANTATION OF SURFACE LAYER OF 30ChGSN2A," Surface Review and Letters (SRL), World Scientific Publishing Co. Pte. Ltd., vol. 25(07), pages 1-8, October.
    • Handle: RePEc:wsi:srlxxx:v:25:y:2018:i:07:n:s0218625x19500112
    DOI: 10.1142/S0218625X19500112
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