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FORMATION OF TRIANGULAR Cu MICROCRYSTALS IN Ti/Cu/Si THIN FILMS DURING ANNEALING

Author

Listed:
  • QIJING LIN

    (Collaborative Innovation Center of High-End Manufacturing Equipment, Xi’an Jiaotong University, Xi’an 710054, P. R. China†State Key Laboratory of Mechanical Manufacturing Systems Engineering, Xi’an Jiaotong University, Xi’an 710049, P. R. China‡State Key Laboratory of Digital Manufacturing Equipment & Technology, Huazhong University of Science and Technology, Wuhan 430074, P. R. China§State Key Laboratory of Fluid Power and Mechatronic Systems, Zhejiang University, Hanzhou 310027, P. R. China)

  • WEIXUAN JING

    (#x2020;State Key Laboratory of Mechanical Manufacturing Systems Engineering, Xi’an Jiaotong University, Xi’an 710049, P. R. China)

  • ZHUANGDE JIANG

    (Collaborative Innovation Center of High-End Manufacturing Equipment, Xi’an Jiaotong University, Xi’an 710054, P. R. China†State Key Laboratory of Mechanical Manufacturing Systems Engineering, Xi’an Jiaotong University, Xi’an 710049, P. R. China)

  • NA ZHAO

    (#x2020;State Key Laboratory of Mechanical Manufacturing Systems Engineering, Xi’an Jiaotong University, Xi’an 710049, P. R. China)

  • ZIRONG WU

    (#x2020;State Key Laboratory of Mechanical Manufacturing Systems Engineering, Xi’an Jiaotong University, Xi’an 710049, P. R. China)

  • CHENYING WANG

    (Collaborative Innovation Center of High-End Manufacturing Equipment, Xi’an Jiaotong University, Xi’an 710054, P. R. China†State Key Laboratory of Mechanical Manufacturing Systems Engineering, Xi’an Jiaotong University, Xi’an 710049, P. R. China)

  • SHUMING YANG

    (#x2020;State Key Laboratory of Mechanical Manufacturing Systems Engineering, Xi’an Jiaotong University, Xi’an 710049, P. R. China)

Abstract

Sandwich stacked Ti/Cu/Si thin films were deposited on a single-side polished Si(111) substrate using DC magnetron sputtering system and annealed using a rapid thermal annealing (RTA) system. Complex dendritic patterns, whose branches are composed of Cu rods and triangular Cu microcrystals were obtained on Ti/Cu thin film annealed at 700∘C. The shape of one triangular Cu microcrystal is a truncated equilateral triangular pyramid with a flat top. Triangular Cu microcrystals grow in the number when Ti/Cu thin films are annealed at 800∘C. Experimental results show that anisotropy affects the growth of surface patterns and the top Ti capping layer works as a protection for the underlying Cu layer from oxidation.

Suggested Citation

  • Qijing Lin & Weixuan Jing & Zhuangde Jiang & Na Zhao & Zirong Wu & Chenying Wang & Shuming Yang, 2018. "FORMATION OF TRIANGULAR Cu MICROCRYSTALS IN Ti/Cu/Si THIN FILMS DURING ANNEALING," Surface Review and Letters (SRL), World Scientific Publishing Co. Pte. Ltd., vol. 25(05), pages 1-5, July.
    • Handle: RePEc:wsi:srlxxx:v:25:y:2018:i:05:n:s0218625x1850097x
    DOI: 10.1142/S0218625X1850097X
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